Creating Advanced 2D Semiconductor Wafers For Modern Chip Integration

Researchers at the University of Pennsylvania School of Engineering and Applied Science have developed a high-efficiency 2D semiconductor on a full-scale, industrial-grade wafer. In which indium selenide (InSe), can be applied at temperatures sufficiently low to allow integration with a silicon chip. The semiconductor sector continuously evolves, focusing on enhancing computing power, reducing chip sizes, […]

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Curated by Jesif Ahmed