32-bit Microcontroller Enhances Security For Cybersecurity Requirements

By simplifying compliance and reducing the costs of embedding security, these microcontrollers are essential for protecting a wide range of digital applications against evolving threats. 

Microchip Technology Inc. has recently launched a new series of 32-bit microcontrollers, the PIC32CK family, featuring embedded security technologies. This launch comes at a critical time, as new legislation effective in 2024 intensifies cybersecurity requirements across a spectrum of digital applications, from consumer IoT devices to crucial infrastructure. The microcontrollers incorporate an integrated Hardware Security Module (HSM) and Arm Cortex-M33 core with TrustZone technology, designed to meet these stringent new mandates. This combination not only simplifies compliance but significantly reduces the cost and complexity associated with embedding top-tier security in product designs. The inclusion of HSM and TrustZone technologies offers robust security measures like secure boot, secure debug, and secure updates, crucial for protecting against evolving cyber threats.

The technical architecture of the microcontrollers ensures that they are well-equipped for modern security challenges. These technical features include:

• Supports various cryptography standards, both symmetric and asymmetric.
• Includes true random number generation and secure key management.
• Industry’s first 32-bit microcontroller to combine an HSM with TrustZone technology.
• Complies with ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards.
• Offers scalable security, memory, and connectivity options .
• Configurations offer up to 2 MB dual-panel Flash and 512 KB SRAM.
• Connectivity includes 10/100 Ethernet, CAN FD, and USB.

Rod Drake, corporate vice president of Microchip’s MCU32 and MPU32 business units, emphasized the timeliness and importance of this innovation: “Emerging requirements make security mandatory for the majority of IoT connected devices. It makes it cost-effective to provide hardware-based security to mid-range microcontroller applications.” He further highlighted thatthe company’s comprehensive ecosystem of tools and security expertise significantly aids customers in navigating these new regulations, ensuring sustained product lifecycle support. 

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Curated by Jesif Ahmed

Heat-Resistant Memory Technology For Extreme Environments

From deep-earth exploration to the depths of space, discover how this durable technology could power the future of AI and beyond.

When smartphones shut down during a beach day, it’s typically due to their electronic components failing to withstand the heat. This failure occurs because the memory chips aren’t designed to handle extreme temperatures, causing data loss as electrons destabilise and escape. Addressing this issue, researchers at the University of Pennsylvania’s School of Engineering and Applied Science have made a significant breakthrough.

Their teams developed a memory technology that endures temperatures up to 600° Celsius (1112° Fahrenheit). This temperature is more than double the threshold of commercial memory drives. Impressively, their device maintained stability for over 60 hours, suggesting a new benchmark in durability.

The new memory device uses ferroelectric aluminum scandium nitride (AlScN). Unlike traditional silicon-based memories, which fail around 200° Celsius (392° Fahrenheit), AlScN can retain data at much higher temperatures. It operates on a metal-insulator-metal structure featuring nickel and platinum electrodes and a strategically thin AlScN layer, only 45 nanometers thick. This configuration helps maintain efficient operation even as temperatures cause particles within the material to move erratically.

This advancement is not just about enhancing the resilience of memory storage. The researchers envision their technology enabling more sophisticated computing in extreme conditions, such as deep-earth drilling or space exploration, where conventional electronics would falter. For example, their device could drastically improve the efficiency of artificial intelligence (AI) systems that currently suffer from data transfer bottlenecks between the central processing unit and memory storage.

The team highlights another critical benefit of their invention: by integrating memory and processing units more closely, their “memory-enhanced compute” approach could eliminate inefficiencies inherent in traditional computing architectures. This integration could potentially allow high-performance computing in environments where even silicon carbide technology, a standard for high-temperature electronics, falls short.

The team’s innovation, with its potential to revolutionize fields from geothermal energy extraction to interplanetary exploration, opens up exciting possibilities for deploying advanced computing technologies in harsh environments. Their ongoing research aims to further integrate this technology with existing high-temperature computing systems, setting the stage for new applications that require durable, high-speed data processing. This could lead to significant advancements in fields such as deep-earth drilling, space exploration, and even artificial intelligence, demonstrating the broad impact of this breakthrough.

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Auxiliary Power Supply Reference Design

Streamlined design boosts operational efficiency, reliability, meeting rising demands in industrial and solar gear.

In response to the increasing requirements for efficient, reliable, and cost-effective offline Switch Mode Power Supplies (SMPS), particularly in industrial and solar settings, the development of a low-power (<100W) power converter with galvanic isolation becomes paramount. This auxiliary power supply plays a critical role in converting electric power from a High Voltage Direct Current (HV DC) bus to a Low Voltage (LV) source, powering essential control circuits, sensing circuits, cooling fans, and various equipment, ensuring optimal functionality and performance.

The design by Microchip offers efficient high-voltage (HV) to low-voltage (LV) conversion for LV subsystems, incorporating a single switch mode flyback topology with a 1700V mSiC MOSFET, which not only ensures efficient conversion but also protects against peak switching voltage and voltage fluctuations across the transformer leakage inductance. The design has a wide range of voltage inputs, from 250V to 1000V, paired with dual-voltage outputs of +24V/2A and +15V/1A, catering to diverse industrial and photovoltaic applications where voltage variations are prevalent. Key features include a single switch mode flyback topology, wide input voltage range, dual voltage outputs, and high power conversion efficiency. The integration of a single switch mode flyback topology enhances efficiency and reliability in HV to LV conversion, while the wide input voltage range ensures adaptability to diverse voltage variations. The provision of dual voltage outputs meets the multifaceted power requirements of various equipment and systems, while the high power conversion efficiency optimizes energy utilization and reduces operational costs through a current-mode Pulse-Width Modulation (PWM) controller-based closed-loop control.

The versatility and reliability of this power converter design make it suitable for a myriad of applications, including industrial motor drives, solar inverters, uninterruptible power supplies (UPS), general-purpose inverters, cascaded H-bridge converters, and modular multilevel converters. In conclusion, the integration of innovative features and robust design principles culminates in a power converter solution that addresses the evolving needs of industrial and photovoltaic applications, setting a benchmark for performance, reliability, and cost-effectiveness in the realm of SMPS technology.

Microchip has thoroughly tested this reference design, which includes Altium design files, a PLECS software model, a user guide, a Bill of Materials (BoM), and more. Additional information about the reference design can be found on the company’s website. For further details on this reference design, please click here.

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Curated by Jesif Ahmed

Graphics Card For Commercial And Industrial Applications

Beyond gaming, the graphic card is useful in Edge AI applications, leveraging OpenVino for streamlined AI development and deep learning integration.

ADLINK Technology Inc. unveils its latest innovation, the EGX-PCIE-A380E  graphics card, marking its debut in the realm of low profile PCIe form factor graphics cards. Embracing the formidable Intel Arc A380E GPU, this pioneering offering targets the thriving commercial gaming sector, encompassing slot machines, video lottery terminals, and electronic games. Seamlessly integrable into the company’s gaming platforms like the ADi-SA6X, which harnesses the prowess of Intel Core processors, the A380E promises unparalleled platform performance.

Crafted for industrial application, it has an exceptional cost-to-performance ratio, coupled with high reliability and minimal power consumption, capped at a mere 50W. Upholding the company’s hallmark commitment to longevity, this industrial-grade marvel assures availability for a minimum of five years. Its slender, single-slot design, measuring a mere 69mm x 156mm, underscores its compactness and versatility.

While its primary domain lies within commercial gaming, the card transcends boundaries, finding relevance in diverse industrial edge AI applications like Industrial IoT and retail analytics. From powering video walls to facilitating media processing and delivery, its utility spans myriad sectors.

Aligned with the OpenVino open-source toolkit, the A380E streamlines AI development and deep learning integration, particularly in computer vision domains. Moreover, it boasts compatibility with DirectX 12, Vulkan 1.3, OpenGL 4.6, OpenCL 3.0, Windows 11, and Linux, ensuring seamless operability across platforms. This latest addition enriches the company’s extensive lineup of A350E/A370E MXM GPU solutions, which harness potent Intel Arc discrete graphics. These modules elevate responsiveness, precision, and reliability, catering to time-sensitive edge applications across healthcare, media processing, transportation, and, of course, commercial gaming.

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TerraMaster Launches the Industry’s First 8-bay 10Gbps Hybrid Storage with an Early Bird 33% Discount

TerraMaster, a professional brand that focuses on providing innovative storage products for homes and businesses, has...

The post TerraMaster Launches the Industry’s First 8-bay 10Gbps Hybrid Storage with an Early Bird 33% Discount appeared first on Electronics-Lab.com.

View more at https://www.electronics-lab.com/terramaster-launches-the-industrys-first-8-bay-10gbps-hybrid-storage-with-an-early-bird-33-discount/.

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Twelve high voltage cable construction techniques used worldwide

This technical article discusses twelve different methods for laying high voltage cables. Out of the ten, four are deemed conventional and eight are deemed progressive. Many various utilities and companies... Read more


The post Twelve high voltage cable construction techniques used worldwide appeared first on EEP - Electrical Engineering Portal. Credit: EEP- Electrical Engineering Portal. Visit:


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Twelve high voltage cable construction techniques used worldwide

This technical article discusses twelve different methods for laying high voltage cables. Out of the ten, four are deemed conventional and eight are deemed progressive. Many various utilities and companies... Read more

The post Twelve high voltage cable construction techniques used worldwide appeared first on EEP - Electrical Engineering Portal.

View more at: https://electrical-engineering-portal.com/high-voltage-cable-construction-techniques Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

Enhancing Efficiency Of Perovskite Solar Cells

This method achieves good results by suppressing phase segregation with a novel pseudo-triple-halide alloy, paving the way for durable and high-efficiency photovoltaics in the quest for sustainable energy solutions.

In the quest for efficient and affordable solar energy solutions, researchers have focused on organic solar cells utilizing perovskite materials. Compared to traditional silicon-based cells, these organic counterparts offer cost advantages, flexibility, and tunability. Despite achieving a certified power conversion efficiency (PCE) of 19.4%, lower than silicon cells, they hold promise for widespread deployment.

Researchers at Soochow University’s Suzhou Key Laboratory of Novel Semiconductor-optoelectronic Materials and Devices propose a breakthrough strategy to enhance the efficiency and stability of perovskite/organic tandem solar cells. Published in Nature Energy, their method addresses a critical issue known as phase segregation, which hampers the performance of wide-bandgap perovskite cells.

The team successfully suppressed phase segregation by introducing a pseudo-triple-halide alloy into mixed halide perovskites, incorporating iodine, bromine, and pseudo-halogen thiocyanate (SCN) ions. This innovation prevents halide elements from separating within the solar cells, improving crystallization and reducing grain boundaries.

The addition of SCN ions slows crystallization, preventing ion migration and facilitating electric charge movement within the solar cell. These ions enter the perovskite lattice, forming an alloy and occupying iodine vacancies, thereby blocking halide ion migration through steric hindrance.

The researchers achieved good results by testing their strategy on perovskite/organic tandem solar cells. The tandem cells exhibited a PCE of 25.82%, a certified PCE of 25.06%, and operational stability lasting 1,000 hours. This success underscores the potential of their methodology to advance the development of stable, high-efficiency perovskite/organic photovoltaics.

Looking ahead, the team claims that their research could be adapted to various wide-bandgap perovskite compositions, further enhancing the performance and longevity of solar cells. Ultimately, these advancements may lead to the realization of durable photovoltaic systems operating efficiently under diverse lighting conditions, heralding a new era of sustainable energy generation.

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Curated by Jesif Ahmed

JOB: Software / Hardware Engineer At Intel In Bengaluru

APPLY HERE

Location: Bengaluru

Company: Intel

• Develops the logic design, register transfer level (RTL) coding, and simulation for an IP required to generate cell libraries, functional units, IP blocks, and subsystems for integration in full chip designs. Participates in the definition of architecture and microarchitecture features of the block being designed.
• Applies various strategies, tools, and methods to write RTL and optimize logic to qualify the design to meet power, performance, area, and timing goals as well as design integrity for physical implementation.
• Reviews the verification plan and implementation to ensure design features are verified correctly and resolves and implements corrective measures for failing RTL tests to ensure correctness of features.
• Supports SoC customers to ensure high-quality integration and verification of the IP block. Drives quality assurance compliance for smooth IP-SoC handoff.

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Curated by Jesif Ahmed

JOB: DCS Field Service Engineer At Emerson In Noida

APPLY HERE

Location: Noida

Company: Emerson

In this Role, Your Responsibilities Will Be:

Field Services

• Formation of Ovation structure / Architecture
• Ovation system loading and re-loading at site and network troubleshooting.
• Locate, differentiate, and analyze the problems arising in design of logic.
• Locate, differentiate, and analyze the problems arising from field, hardware errors and DCS.
• Perform and Maintain protocols for loop check, device check and panel charging.
• Loop and device checking and necessary modifications in logics, graphics, and database as per Customer /site requirements
• DCS erection supervision and commissioning at site
• Establish DCS Network and configuration.
• Work closely with GEC and global Emerson support team for troubleshooting.
• Troubleshooting of DCS HW (e.g. Controllers, I/O Modules, DBS, OWS, EWS etc.)
• Configuration/troubleshooting of Historian, AMS and Advance Algorithms
• Perform third party communication e.g. ELC, SLC, Profi bus, SCADA & OPC etc.
• Excellent knowledge on Power Plant Technology (Thermal, Combined Cycle)
• Exposure on Closed Loop Tuning in Thermal Power Plant 

Additional Responsibilities:

• Lead site activities independently, if required
• Participation in meetings with customer and front offices
• Prepare daily / weekly reports and MOM as required.

Project Engineering

• Design/Implementation of controls from SAMA /Functional diagrams.
• Implementation of graphics from sketches/snapshots
• Creation/modification of Ovation Internal Point Database
• Implementation of Simulation logics for First-Pass Test
• Virtual controller setup for testing purpose
• Testing of implemented controls and graphics& troubleshooting while testing.
• Follow Department Quality processes and procedures.
• Scaling of Open loops & closed loops as per the ranges in the HW database
• Use various Productivity tools such as DBID tool, Audit Tool, Database Productivity Tool, etc.
• Conversion of controls and graphics of Third Party DCS/PLC systems to Ovation
• Third Party Communication
• Support Factory Acceptance Test (FAT) activities!
• In-house Ovation Server/ Workstation loading

Who You Are:

You pursue everything with energy, drive and the need to finish. You deliver messages in a clear, compelling, and concise manner and actively listens and checks for understanding. You lay out a detailed schedule and steps for achieving objectives and use landmarks to track and handle the progress of the work.

For This Role, You Will Need

• 4 years bachelor’s degree / Master’s Degree in ECE, EEE, I&C, E&I.
• Proven experience of 2 to 5 years of in Power Plant process, project engineering and commissioning

Preferred Qualifications that Set You Apart:

• Excellent written and verbal communication skills.
• Problem-solving, decision-making, and planning skills.
• Ability to write reports, business correspondence and commissioning documents.
• Ability to optimally present information and respond to queries from management, clients and customers.

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Curated by Jesif Ahmed