Thermal constraining technique stabilizes ferroelectric transistors, boosting efficiency and endurance for next-gen electronics. A team led by Professor Taesung Kim at Sungkyunkwan University has unveiled a semiconductor design technique that uses thermal forces to dramatically improve next-generation AI chip performance while trimming energy use a development that could help solve one of electronics’ toughest challenges: […]View more at https://www.electronicsforu.com/news/thermal-design-reshapes-ai-chips.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
