The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die systems more efficiently in AI data centre applications. Keysight Technologies has introduced 3D Interconnect Designer, part of its EDA portfolio, to support the growing intricacy of chiplet and 3DIC packages. The software aims to streamline workflows […]View more at https://www.electronicsforu.com/news/tackling-complexity-in-3d-chiplet-designing.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
