Class D Audio Amplifier Reference Design

The audio amplifier reference design is efficient for rapid prototyping on microcontroller platforms, enhancing audio performance.

Class-D audio amplifiers are highly valued for their efficiency, often exceeding 90%, which makes them ideal for battery-operated devices and applications where heat dissipation is a concern. Unlike traditional amplifiers that waste a significant portion of their energy as heat, Class-D amplifiers convert most of their power input into audio output, reducing energy costs and improving sustainability. Their compact size and lower heat generation allow for smaller, more portable designs. Moreover, the high efficiency of Class-D amplifiers doesn’t compromise sound quality, making them suitable for both consumer electronics and professional audio systems. The 1kW Class-D Audio Amplifier reference design from NXP Semiconductors is a model for constructing an audio amplifier with a push-pull power converter. It operates on the Kinetis KV1x Tower series platform. This design utilizes the internal FlexTimer module to modulate the input analogue audio in a Class-D format and generate PWM signals to control the switching push-pull power supply.

The 1kW Class-D Audio Amplifier boasts several features that streamline its design and enhance its performance. It enables rapid prototyping using either the Tower System module or the Freedom System platform, essential for capturing analog audio input, generating Class-D audio output, and controlling the push-pull power supply. The amplifier comes with embedded source code, allowing for the quick and cost-effective construction of a Class-D audio amplifier. Additionally, the FlexTimer manages the gate drivers for the power MOSFETs, incorporating several protections such as dead-time insertion, fault control, initialization, and polarity control. This efficient design minimizes CPU load, freeing up the processor for further application enhancements.

The FlexTimer feature in the system controls the gate drivers for power MOSFETs, adding several layers of protection, including dead-time insertion, fault control, initialization, and polarity control. This setup ensures operational safety and reliability while minimizing the CPU load. As a result, more processor resources remain available for enhancing and expanding applications.

The tools and software required for operation include the TWR-KV10Z32 module and the Kinetis Design Studio version 3.0.0 or higher. These components are essential for the system’s setup and functionality.

NXP has tested this reference design. It comes with a bill of materials (BOM), schematics, a design file, etc. You can find additional data about the reference design on the company’s website. To read more about this reference design, click here.

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ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI

Arm Targets the AIoT with High-Performance Ethos-U85 NPU and Corstone-320 Platform New accelerator boasts four times...

The post ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI appeared first on Electronics-Lab.com.

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Mastering Electrical Connectivity: From Circuit Topology to Switching Classifications

This technical article aims to delve into various aspects of electrical connectivity, symbol representation, and isolation methodologies, shedding light on fundamental concepts and practical applications within the field. From the... Read more


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Mastering Electrical Connectivity: From Circuit Topology to Switching Classifications

This technical article aims to delve into various aspects of electrical connectivity, symbol representation, and isolation methodologies, shedding light on fundamental concepts and practical applications within the field. From the... Read more

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View more at: https://electrical-engineering-portal.com/electrical-connectivity-circuit-topology-switching-classifications Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

Indusboard-Based Smallest GPS Tracker

GPS tracking is one of the most important technologies in today’s world. From parcel updates to navigation and many different fields, we rely on GPS.

However, if we want to track smaller items such as baggage or monitor the location of children, or if we intend to monitor someone discreetly, we often require a compact and inconspicuous device that can be easily attached without occupying much space.

Today, we will design the smallest GPS tracker that you can use as a key ring or attach as a small tag to bags to track children, affix to the necks of animals, or integrate with vehicles, parcels, or individuals for tracking purposes.

In our design, the primary requirement is to maintain a compact size within 3cm. Therefore, we opted for the Indusboard Coin as the base.

Additionally, to ensure the GPS unit remains small, we selected the L86 GPS module, measuring only 1.5 cm and equipped with an integrated GPS antenna.

For transmitting data via GSM, we incorporated the SIM800l module, which operates on the 2G band. However, if higher network speeds are desired, it’s possible to substitute this with a 4G or 5G GSM module.

Bill of Material

Fig 1. Parts List

Indusboard-based Smallest GPS Tracker – Design

In our design process, we decided to use the L86 GPS module. It communicates through a serial port with a speed of 9600 baud. The Indusboard, which we’re using, supports both software and hardware serial.

We can configure any pins for this purpose, but by default, pins 43 and 44 serve as RX and TX serial pins on the board. So, we’re using this hardware serial connection for the L86 GPS.

The L86 GPS module needs power in the range of 2.8V to 4V, and it typically uses around 100mA when it’s working. Luckily, the board we’re using already has a pin that can handle this power. So, we’re connecting the GPS module to the 3.3V and GND pins on the Indusboard for power.

Fig 2. GPS powering system details – L86 GPS module Features

The GPS module comes with an RTC backup power pin. This feature, according to the datasheet, allows the Real-Time Clock (RTC) to keep track of time even if the main power is disconnected. Typically, you can attach any 3.3V coin cell battery to this pin for backup power.

However, in our design, we decided to simplify things by using the same voltage source for the main power and the RTC backup. So, we’re connecting this RTC backup power pin to the same 3.3V source that powers the GPS module.

Fig 3. L86 GPS module pinout (Source datasheet of L86 GPS module)

Next, we incorporated the GSM module into the design. Most GSM modules, including the SIM800l, SIM808, and others, also utilize serial communication. For this purpose, we designated pins 43 and 41 as the serial pins.

Like the GPS module, we powered the GSM module using the same 3.3V and GND power supply of the board.

Additionally, if you desire to view network status, receive SMS and access location coordinates such as latitude and longitude, you have the option to include the SSD1306 OLED display.

However, it’s important to note that this addition will increase both the bill of materials and power consumption of the device. Although not included here, our design accommodates this feature by providing the necessary connections for the SSD1306 OLED display.

Now you can solder all the components according to the circuit diagram. (Fig 4).

Fig 4. Connection diagram of Indusboard-based smallest GPS Tracker device

After soldering the components together, we’ll place the GSM module and secure it either on the top or bottom of the board. Similarly, we’ll position the GPS module in the same manner as depicted in Figure 5 and Figure 6.

Fig 5. Indusboard-based smallest GPS Tracker device

Fig 6. GPS tracker using Indusboard and L86 GPS module

Now you can design the keyring and tag case over the device and attach it anywhere to use it.

Fig 7. GPS tracker ring using Indusboard

Code for GPS Tracker using Indusboard

Firstly, we’ll install the Async message library. Then, we’ll define the serial pins and baud rates for both the GPS and GSM modules. The default baud rate for GSM is 4800, and for GPS, it’s 9600.

Next, we’ll create a function to retrieve the GPS location and send it to the predefined number at a one-minute time interval. You have the flexibility to adjust this time interval according to your requirements.

Additionally, you can implement features such as responding with a location map link when a specific message is received by the device. The code offers various customization options to tailor it to your needs.

Fig 8. Indusboard-based smallest GPS Tracker Programming

Testing Smallest GPS Tracker using Indusboard

Once the device is powered using a 3.3V rechargeable battery, insert a SIM card with a message pack into the GSM module. After a few minutes, when the SIM module establishes a connection with the network provider, it begins sending real-time location updates to your phone.

When you tap on the link received, you can view the location on Google Maps, providing you with accurate tracking information.

Fig. 9 – Indusboard-based GPS Tracking

Fig 10. GPS tracker showing the location of the device

Smallest GPS Tracker CodeDownload

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3D IC Solutions For RFSOI Technology

RF integration in modern devices, addressing the escalating bandwidth demands of 5G networks while laying the groundwork for future wireless communication systems.

In recent developments in the semiconductor industry, United Microelectronics Corporation (UMC) introduced a 3D IC solution tailored to radio frequency silicon on an insulator (RFSOI) technology. This solution, implemented on UMC’s 55nm RFSOI platform, facilitates reduction in die size by over 45% while maintaining optimal radio frequency (RF) performance. This advancement enables the seamless integration of additional RF components to meet the escalating bandwidth demands of 5G networks.

UMC conducted research in Hsinchu, Taiwan. The key development involves using wafer-to-wafer bonding technology, which enables the vertical stacking of dies to diminish surface area without compromising RF performance. This method effectively resolves the issue of RF interference between stacked dies, ensuring enhanced functionality.

The solution for RFSOI directly addresses the challenge posed by the growing complexity of RF front-end modules (RF-FEM) in modern devices, particularly smartphones. By vertically stacking dies, the solution optimizes space utilization, accommodating more frequency bands in parallel and facilitating seamless data transmission and reception. This breakthrough technology is not only crucial for the 5G/6G era but also holds significant implications for diverse applications including mobile, IoT, and virtual reality devices.

The team claims that this marks a significant milestone in the semiconductor industry. By effectively addressing the challenges associated with RF integration in modern devices, this technology not only enhances the performance of current applications but also lays the foundation for future advancements in wireless communication systems. With ongoing research and development efforts, they aims to further refine stacked die solutions to meet the evolving demands of RF technologies, ensuring continued innovation in the field.

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32-bit Microcontroller Enhances Security For Cybersecurity Requirements

By simplifying compliance and reducing the costs of embedding security, these microcontrollers are essential for protecting a wide range of digital applications against evolving threats. 

Microchip Technology Inc. has recently launched a new series of 32-bit microcontrollers, the PIC32CK family, featuring embedded security technologies. This launch comes at a critical time, as new legislation effective in 2024 intensifies cybersecurity requirements across a spectrum of digital applications, from consumer IoT devices to crucial infrastructure. The microcontrollers incorporate an integrated Hardware Security Module (HSM) and Arm Cortex-M33 core with TrustZone technology, designed to meet these stringent new mandates. This combination not only simplifies compliance but significantly reduces the cost and complexity associated with embedding top-tier security in product designs. The inclusion of HSM and TrustZone technologies offers robust security measures like secure boot, secure debug, and secure updates, crucial for protecting against evolving cyber threats.

The technical architecture of the microcontrollers ensures that they are well-equipped for modern security challenges. These technical features include:

• Supports various cryptography standards, both symmetric and asymmetric.
• Includes true random number generation and secure key management.
• Industry’s first 32-bit microcontroller to combine an HSM with TrustZone technology.
• Complies with ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards.
• Offers scalable security, memory, and connectivity options .
• Configurations offer up to 2 MB dual-panel Flash and 512 KB SRAM.
• Connectivity includes 10/100 Ethernet, CAN FD, and USB.

Rod Drake, corporate vice president of Microchip’s MCU32 and MPU32 business units, emphasized the timeliness and importance of this innovation: “Emerging requirements make security mandatory for the majority of IoT connected devices. It makes it cost-effective to provide hardware-based security to mid-range microcontroller applications.” He further highlighted thatthe company’s comprehensive ecosystem of tools and security expertise significantly aids customers in navigating these new regulations, ensuring sustained product lifecycle support. 

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Heat-Resistant Memory Technology For Extreme Environments

From deep-earth exploration to the depths of space, discover how this durable technology could power the future of AI and beyond.

When smartphones shut down during a beach day, it’s typically due to their electronic components failing to withstand the heat. This failure occurs because the memory chips aren’t designed to handle extreme temperatures, causing data loss as electrons destabilise and escape. Addressing this issue, researchers at the University of Pennsylvania’s School of Engineering and Applied Science have made a significant breakthrough.

Their teams developed a memory technology that endures temperatures up to 600° Celsius (1112° Fahrenheit). This temperature is more than double the threshold of commercial memory drives. Impressively, their device maintained stability for over 60 hours, suggesting a new benchmark in durability.

The new memory device uses ferroelectric aluminum scandium nitride (AlScN). Unlike traditional silicon-based memories, which fail around 200° Celsius (392° Fahrenheit), AlScN can retain data at much higher temperatures. It operates on a metal-insulator-metal structure featuring nickel and platinum electrodes and a strategically thin AlScN layer, only 45 nanometers thick. This configuration helps maintain efficient operation even as temperatures cause particles within the material to move erratically.

This advancement is not just about enhancing the resilience of memory storage. The researchers envision their technology enabling more sophisticated computing in extreme conditions, such as deep-earth drilling or space exploration, where conventional electronics would falter. For example, their device could drastically improve the efficiency of artificial intelligence (AI) systems that currently suffer from data transfer bottlenecks between the central processing unit and memory storage.

The team highlights another critical benefit of their invention: by integrating memory and processing units more closely, their “memory-enhanced compute” approach could eliminate inefficiencies inherent in traditional computing architectures. This integration could potentially allow high-performance computing in environments where even silicon carbide technology, a standard for high-temperature electronics, falls short.

The team’s innovation, with its potential to revolutionize fields from geothermal energy extraction to interplanetary exploration, opens up exciting possibilities for deploying advanced computing technologies in harsh environments. Their ongoing research aims to further integrate this technology with existing high-temperature computing systems, setting the stage for new applications that require durable, high-speed data processing. This could lead to significant advancements in fields such as deep-earth drilling, space exploration, and even artificial intelligence, demonstrating the broad impact of this breakthrough.

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Auxiliary Power Supply Reference Design

Streamlined design boosts operational efficiency, reliability, meeting rising demands in industrial and solar gear.

In response to the increasing requirements for efficient, reliable, and cost-effective offline Switch Mode Power Supplies (SMPS), particularly in industrial and solar settings, the development of a low-power (<100W) power converter with galvanic isolation becomes paramount. This auxiliary power supply plays a critical role in converting electric power from a High Voltage Direct Current (HV DC) bus to a Low Voltage (LV) source, powering essential control circuits, sensing circuits, cooling fans, and various equipment, ensuring optimal functionality and performance.

The design by Microchip offers efficient high-voltage (HV) to low-voltage (LV) conversion for LV subsystems, incorporating a single switch mode flyback topology with a 1700V mSiC MOSFET, which not only ensures efficient conversion but also protects against peak switching voltage and voltage fluctuations across the transformer leakage inductance. The design has a wide range of voltage inputs, from 250V to 1000V, paired with dual-voltage outputs of +24V/2A and +15V/1A, catering to diverse industrial and photovoltaic applications where voltage variations are prevalent. Key features include a single switch mode flyback topology, wide input voltage range, dual voltage outputs, and high power conversion efficiency. The integration of a single switch mode flyback topology enhances efficiency and reliability in HV to LV conversion, while the wide input voltage range ensures adaptability to diverse voltage variations. The provision of dual voltage outputs meets the multifaceted power requirements of various equipment and systems, while the high power conversion efficiency optimizes energy utilization and reduces operational costs through a current-mode Pulse-Width Modulation (PWM) controller-based closed-loop control.

The versatility and reliability of this power converter design make it suitable for a myriad of applications, including industrial motor drives, solar inverters, uninterruptible power supplies (UPS), general-purpose inverters, cascaded H-bridge converters, and modular multilevel converters. In conclusion, the integration of innovative features and robust design principles culminates in a power converter solution that addresses the evolving needs of industrial and photovoltaic applications, setting a benchmark for performance, reliability, and cost-effectiveness in the realm of SMPS technology.

Microchip has thoroughly tested this reference design, which includes Altium design files, a PLECS software model, a user guide, a Bill of Materials (BoM), and more. Additional information about the reference design can be found on the company’s website. For further details on this reference design, please click here.

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Graphics Card For Commercial And Industrial Applications

Beyond gaming, the graphic card is useful in Edge AI applications, leveraging OpenVino for streamlined AI development and deep learning integration.

ADLINK Technology Inc. unveils its latest innovation, the EGX-PCIE-A380E  graphics card, marking its debut in the realm of low profile PCIe form factor graphics cards. Embracing the formidable Intel Arc A380E GPU, this pioneering offering targets the thriving commercial gaming sector, encompassing slot machines, video lottery terminals, and electronic games. Seamlessly integrable into the company’s gaming platforms like the ADi-SA6X, which harnesses the prowess of Intel Core processors, the A380E promises unparalleled platform performance.

Crafted for industrial application, it has an exceptional cost-to-performance ratio, coupled with high reliability and minimal power consumption, capped at a mere 50W. Upholding the company’s hallmark commitment to longevity, this industrial-grade marvel assures availability for a minimum of five years. Its slender, single-slot design, measuring a mere 69mm x 156mm, underscores its compactness and versatility.

While its primary domain lies within commercial gaming, the card transcends boundaries, finding relevance in diverse industrial edge AI applications like Industrial IoT and retail analytics. From powering video walls to facilitating media processing and delivery, its utility spans myriad sectors.

Aligned with the OpenVino open-source toolkit, the A380E streamlines AI development and deep learning integration, particularly in computer vision domains. Moreover, it boasts compatibility with DirectX 12, Vulkan 1.3, OpenGL 4.6, OpenCL 3.0, Windows 11, and Linux, ensuring seamless operability across platforms. This latest addition enriches the company’s extensive lineup of A350E/A370E MXM GPU solutions, which harness potent Intel Arc discrete graphics. These modules elevate responsiveness, precision, and reliability, catering to time-sensitive edge applications across healthcare, media processing, transportation, and, of course, commercial gaming.

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TerraMaster Launches the Industry’s First 8-bay 10Gbps Hybrid Storage with an Early Bird 33% Discount

TerraMaster, a professional brand that focuses on providing innovative storage products for homes and businesses, has...

The post TerraMaster Launches the Industry’s First 8-bay 10Gbps Hybrid Storage with an Early Bird 33% Discount appeared first on Electronics-Lab.com.

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Twelve high voltage cable construction techniques used worldwide

This technical article discusses twelve different methods for laying high voltage cables. Out of the ten, four are deemed conventional and eight are deemed progressive. Many various utilities and companies... Read more


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Twelve high voltage cable construction techniques used worldwide

This technical article discusses twelve different methods for laying high voltage cables. Out of the ten, four are deemed conventional and eight are deemed progressive. Many various utilities and companies... Read more

The post Twelve high voltage cable construction techniques used worldwide appeared first on EEP - Electrical Engineering Portal.

View more at: https://electrical-engineering-portal.com/high-voltage-cable-construction-techniques Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

Enhancing Efficiency Of Perovskite Solar Cells

This method achieves good results by suppressing phase segregation with a novel pseudo-triple-halide alloy, paving the way for durable and high-efficiency photovoltaics in the quest for sustainable energy solutions.

In the quest for efficient and affordable solar energy solutions, researchers have focused on organic solar cells utilizing perovskite materials. Compared to traditional silicon-based cells, these organic counterparts offer cost advantages, flexibility, and tunability. Despite achieving a certified power conversion efficiency (PCE) of 19.4%, lower than silicon cells, they hold promise for widespread deployment.

Researchers at Soochow University’s Suzhou Key Laboratory of Novel Semiconductor-optoelectronic Materials and Devices propose a breakthrough strategy to enhance the efficiency and stability of perovskite/organic tandem solar cells. Published in Nature Energy, their method addresses a critical issue known as phase segregation, which hampers the performance of wide-bandgap perovskite cells.

The team successfully suppressed phase segregation by introducing a pseudo-triple-halide alloy into mixed halide perovskites, incorporating iodine, bromine, and pseudo-halogen thiocyanate (SCN) ions. This innovation prevents halide elements from separating within the solar cells, improving crystallization and reducing grain boundaries.

The addition of SCN ions slows crystallization, preventing ion migration and facilitating electric charge movement within the solar cell. These ions enter the perovskite lattice, forming an alloy and occupying iodine vacancies, thereby blocking halide ion migration through steric hindrance.

The researchers achieved good results by testing their strategy on perovskite/organic tandem solar cells. The tandem cells exhibited a PCE of 25.82%, a certified PCE of 25.06%, and operational stability lasting 1,000 hours. This success underscores the potential of their methodology to advance the development of stable, high-efficiency perovskite/organic photovoltaics.

Looking ahead, the team claims that their research could be adapted to various wide-bandgap perovskite compositions, further enhancing the performance and longevity of solar cells. Ultimately, these advancements may lead to the realization of durable photovoltaic systems operating efficiently under diverse lighting conditions, heralding a new era of sustainable energy generation.

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JOB: Software / Hardware Engineer At Intel In Bengaluru

APPLY HERE

Location: Bengaluru

Company: Intel

• Develops the logic design, register transfer level (RTL) coding, and simulation for an IP required to generate cell libraries, functional units, IP blocks, and subsystems for integration in full chip designs. Participates in the definition of architecture and microarchitecture features of the block being designed.
• Applies various strategies, tools, and methods to write RTL and optimize logic to qualify the design to meet power, performance, area, and timing goals as well as design integrity for physical implementation.
• Reviews the verification plan and implementation to ensure design features are verified correctly and resolves and implements corrective measures for failing RTL tests to ensure correctness of features.
• Supports SoC customers to ensure high-quality integration and verification of the IP block. Drives quality assurance compliance for smooth IP-SoC handoff.

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JOB: DCS Field Service Engineer At Emerson In Noida

APPLY HERE

Location: Noida

Company: Emerson

In this Role, Your Responsibilities Will Be:

Field Services

• Formation of Ovation structure / Architecture
• Ovation system loading and re-loading at site and network troubleshooting.
• Locate, differentiate, and analyze the problems arising in design of logic.
• Locate, differentiate, and analyze the problems arising from field, hardware errors and DCS.
• Perform and Maintain protocols for loop check, device check and panel charging.
• Loop and device checking and necessary modifications in logics, graphics, and database as per Customer /site requirements
• DCS erection supervision and commissioning at site
• Establish DCS Network and configuration.
• Work closely with GEC and global Emerson support team for troubleshooting.
• Troubleshooting of DCS HW (e.g. Controllers, I/O Modules, DBS, OWS, EWS etc.)
• Configuration/troubleshooting of Historian, AMS and Advance Algorithms
• Perform third party communication e.g. ELC, SLC, Profi bus, SCADA & OPC etc.
• Excellent knowledge on Power Plant Technology (Thermal, Combined Cycle)
• Exposure on Closed Loop Tuning in Thermal Power Plant 

Additional Responsibilities:

• Lead site activities independently, if required
• Participation in meetings with customer and front offices
• Prepare daily / weekly reports and MOM as required.

Project Engineering

• Design/Implementation of controls from SAMA /Functional diagrams.
• Implementation of graphics from sketches/snapshots
• Creation/modification of Ovation Internal Point Database
• Implementation of Simulation logics for First-Pass Test
• Virtual controller setup for testing purpose
• Testing of implemented controls and graphics& troubleshooting while testing.
• Follow Department Quality processes and procedures.
• Scaling of Open loops & closed loops as per the ranges in the HW database
• Use various Productivity tools such as DBID tool, Audit Tool, Database Productivity Tool, etc.
• Conversion of controls and graphics of Third Party DCS/PLC systems to Ovation
• Third Party Communication
• Support Factory Acceptance Test (FAT) activities!
• In-house Ovation Server/ Workstation loading

Who You Are:

You pursue everything with energy, drive and the need to finish. You deliver messages in a clear, compelling, and concise manner and actively listens and checks for understanding. You lay out a detailed schedule and steps for achieving objectives and use landmarks to track and handle the progress of the work.

For This Role, You Will Need

• 4 years bachelor’s degree / Master’s Degree in ECE, EEE, I&C, E&I.
• Proven experience of 2 to 5 years of in Power Plant process, project engineering and commissioning

Preferred Qualifications that Set You Apart:

• Excellent written and verbal communication skills.
• Problem-solving, decision-making, and planning skills.
• Ability to write reports, business correspondence and commissioning documents.
• Ability to optimally present information and respond to queries from management, clients and customers.

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JOB: Analog/RF IC Design Engineer At SignalChip In Bengaluru

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Location: Bengaluru

Company: SignalChip

Roles & Responsibilities

Accountable for specification, design and verification of mixed-signal and RF chains/blocks including power amplifiers, line drivers, low noise amplifiers, transmit and receive mixers, frequency synthesizer, base-band amplifiers and filters, voltage regulators and band-gap circuits, phase-locked loops (PLLs) and delayed-lock loops (DLLs), data converters (DACs/ADCs), and switched-capacitor circuits. Work closely with digital and system engineers to optimize the system.

Education, Experience & Skills

Master’s/Bachelor’s Degree in engineering from a reputable college. 1 – 8 years of experience in analog transistor-level design in deep sub-micron CMOS. Knowledge of integrated mixed-signal circuits, RF system and architecture is desired. Should take complete ownership of IPs from specification derivation till production. Experience in SPICE and MATLAB simulations is a must. Familiarity with digital signal processing and ESD protection techniques is a plus.

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JOB: Field Application Manager At Macnica Cytech In Bengaluru

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Location: Bengaluru

Company: Macnica Cytech

Job Description

• Drive team of FAEs across india for demand creation
• Drive design in and product promotional activities
• Spearhead development of new demand creation accounts
• Align and coordinate with suppliers for all technical promotion activities
• Excellent troubleshooting skills to provide in-depth technical support to customers
• Conduct seminars and training to customers

Qualification & Requirements

• Diploma or Degree in Electronics & Electrical Engineering.
• Possess good knowledge and application experience on MCU, Analog & Power Management design
• Hands-on Knowledge on programming languages like C
• Minimum 8 years relevant working experiences with in electronic industry
• Possess good presentation and communication skills
• Able to work independently as well as a good team player
• Overseas travel maybe required

The post JOB: Field Application Manager At Macnica Cytech In Bengaluru appeared first on Electronics For You.

View more at https://www.electronicsforu.com/career/field-application-manager-macnica-cytech-bengaluru.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Rockchip RK3566 Powred BIGTREETECH Pi 2 Features Gigabit Ethernet, Dual-band Wi-Fi and more

The BIGTREETECH Pi 2 is a powerful single-board computer (SBC) powered by the Rockchip RK3566 chipset....

The post Rockchip RK3566 Powred BIGTREETECH Pi 2 Features Gigabit Ethernet, Dual-band Wi-Fi and more appeared first on Electronics-Lab.com.

View more at https://www.electronics-lab.com/rockchip-rk3566-powred-bigtreetech-pi-2-features-gigabit-ethernet-dual-band-wi-fi-and-more/.

Credit- ELECTRONICS-LAB. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Power Electronics Engineer At Cyient In Bengaluru

APPLY HERE ON LINKEDIN

Location: Bengaluru

Company: Cyient

Notice Period: 0-30 Days Max

Qualification: BTech/MTech in EEE/ECE/IT/TC/Power electronics

• Expertise in System architecture, inverter/converter topologies, complete knowhow of printed circuit boards, thermal management and product enclosures and interactions.
• Experience of modeling, development and testing of power electronics systems, including the development of test and validation plans
• Experience in developing the Products complying to various industry standards and regulations in aerospace/ medical/ defense/ automotive/ consumer/ industrial domain.
• Experience with various power conversion topologies, DC/DC, PFC Converters, DC/AC Inverters , Motor Control, high-voltage/high-power converters, Micro-controllers & Peripherals HW, Digital System, Analog Electronics Design, Magnetics Design (High Frequency Inductors/Switched Mode Flyback/Forward Transformers)
• Responsible for requirements capture, high level product conception, product specifications based on requirements received from the customer.
• Guiding the design and testing team in designing, simulating and testing the power electronics, analog and digital electronics circuits and analyzing the outcomes to take further decisions or make conclusions
• Responsible for design improvisation and optimization for performance, cost and manufacturability
• Responsible for drafting reports, reviewing work schedules, maintain work system logs etc.
• Providing deliverable such as: complete Bill-of-Materials, block-diagrams, schematics, PCB design documentation, specifications, test data results, and other necessary documentation (HRD, HDD, ATP, DVTP, RCA, WBS)
• Prepare technical presentations, proposals
• Excellent technical engineering knowledge coupled with solid people leadership skills.
• Oversee product development, manage project delivery in an organized, timely and efficient manner
• Manage feasibility studies and technical analysis to support new products
• Leading the team, mentor & train junior engineers

The post JOB: Power Electronics Engineer At Cyient In Bengaluru appeared first on Electronics For You.

View more at https://www.electronicsforu.com/career/power-electronics-engineer-cyient-bengaluru-2.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Electronics Engineer At Iota International In Rohtak

APPLY HERE ON LINKEDIN

Location: Rohtak

Company: iota International

This is a full-time on-site role for an Electronics Engineer at Iota International located in Rohtak. The Electronics Engineer will be responsible for day-to-day tasks such as circuit design, electronic testing, and electrical engineering. They will also be involved in electronic engineering and other related tasks.

Qualifications

• Electronic Engineering and Electrical Engineering skills
• Circuit Design and Electronics skills
• Experience in testing electronic devices
• Problem-solving and troubleshooting skills
• Attention to detail and ability to work with precision
• Strong analytical and mathematical skills
• Knowledge of industry standards and regulations
• Bachelor’s degree in Electronics Engineering or related field
• Relevant certifications or licenses

The post JOB: Electronics Engineer At Iota International In Rohtak appeared first on Electronics For You.

View more at https://www.electronicsforu.com/news/electronics-engineer-iota-international-rohtak.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Technical Lead – Hardware At HARMAN In Pune

APPLY HERE

Location: Pune

Company: HARMAN

Job Description of Hardware Engineer II FIRE India

The future is what you make it.

When you join Honeywell, you become a member of our global team of thinkers, innovators, dreamers, and doers who make the things that make the future.  That means changing the way we fly, fueling jets in an eco-friendly way, keeping buildings smart and safe and even making it possible to breathe on Mars.  Working at Honeywell isn’t just about developing cool things. That’s why our employees enjoy access to dynamic career opportunities across different fields and industries.

Honeywell’s Value Engineering (VE) and Component Engineering (CE) Center of Excellence (COE) is a dynamic collective of professionals dedicated to refining product development through innovative engineering and strategic component selection. Working in tandem with GBE’s Engineering and Procurement teams, the VE/CE COE is a global entity tasked with the critical mission of enhancing product margins and driving productivity, thereby securing Honeywell’s competitive edge in the global market. Our mandate spans across all Strategic Business Groups (SBGs), with the exception of AERO, ensuring that value engineering and component engineering principles are consistently applied to deliver tangible savings and superior products. As a hub of flexibility and rapid adaptation, the VE/CE COE is Honeywell’s strategic response to the “ever-evolving” marketplace demands.

Responsibilities

This position provides an exciting opportunity to advance your Engineering and Engineering Services career within one of the Honeywell’s most profitable and dynamic Business units. This Hardware Engineer role is responsible for driving and supporting projects that focuses on product life cycle management to include obsolescence, cost reductions, and design for supply chain resiliency actions.  The position is in Honeywell’s HBT portfolio for commercial life and safety systems to include products such as Fire alarm panels, detectors, voice alarm systems etc.  The role requires an entrepreneurial approach to apply mechanical design expertise in a global environment while coordinating with cross functional team in design centers, sourcing, manufacturing, quality, and regulatory teams to generate and implement cost saving. This role includes identification of product cost savings opportunities through alternate supplier qualification, product design standardization, and factory transfers.

Key Responsibilities:

• Prepare Test Plans for the project to make sure the alternative component will satisfy all requirements and final product performance meets the specification.
• Review the current electronic board design considering the current technologies in terms of component, materials & process, propose ideations to reduce BoM cost by redesign & optimization.
• Perform Component and Product level Qualification – Provide change description, develop test instructions, and create user guides and manuals.
• Conduct redesign activities of an existing product to gain more domain knowledge about Fire Business and understand how to implement the FIRE standards requirements with help of both regulatory team and more experienced R&D colleagues.
• Perform a key role in Obsolescence / Shortage issues.
• Track record of the design and test (developer test, functional test, automated test, climatic test) using HON specific tools (JIRA, JAMA, etc.).
• Design for Manufacturing and Testability
• Select component/materials and deal with appropriate component selection tools (Preferred Parts List, Preferred Suppliers List, etc.).
• Build and test prototypes, identify issues, and follow up on corrective actions.
• Develop test plans and strategies, specify instrumentation, write test procedures, and analyze test results.

Required Qualifications

• Bachelor Degree in Electronic Engineering or equivalent subject
• Minimum of 5 years’ experience in engineering position, designing electronic products
• Knowledge of Value Analysis/Value Engineering principles and techniques
• Knowledge of electronic components, their parameters and characteristics and experience with conditional qualification testing
• Knowledge of electronic circuits and subsystems.
• Knowledge of PCB CAD design systems, CAD tools, and Simulation Tools
• Experience in EMC and product testing
• Very good written and spoken English, very good communication and negotiation skills, experience multitasking and prioritizing workload.

We Value

• Experience in Engineering Testing
• Experience with UL/CSA/CE standards, statistical methods and tools, MS Office

The post JOB: Technical Lead – Hardware At HARMAN In Pune appeared first on Electronics For You.

View more at https://www.electronicsforu.com/career/technical-lead-hardware-harman-pune.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Industrial Grade Isolated USB to UART Converter

In embedded systems, UART/serial ports are mainly used to view debug messages, to flash the program or to configure the device via command/response protocol.

The Industrial Grade Isolated USB to UART could be useful in various use cases.

High Voltage AC / DC Circuits

Isolated USB to UART Converter is mainly helpful for companies/engineers involved in building power electronics products or dealing with high-voltage DC or AC signals on their boards and want to connect them to a Laptop or PC safely.

Connecting the board with HV AC or DC to a Laptop or PC USB port without isolation may damage the port or laptop. Non-isolated USB to UART converters also induce leakage currents in many situations and can significantly increase noise.

Low Power Embedded Designs which needs 2.5V/1.8V

If you are working on Low-Power Designs like battery-powered asset trackers, wearables, or any battery-powered device, where UART is at a lower voltage level, you will need a USB-to-UART converter that supports those voltage levels.

That’s why CAPUF Embedded’s Isolated USB to UART Converter will help as a voltage section(1.8/2.5/3.3/5.0V) is provided.

Medical Electronics / Noise Sensitive circuits

As safety/induced noise is a great concern in many designs, an isolated USB to UART converter provides the best solution to connect your Embedded Board or product safely with a Laptop or PC.

What is Unique about our Isolated USB to UART Converter?

1. The board is designed and manufactured in India.
2. A 4-channel DIP Switch is provided for an easy voltage level selection (1.8V/2.5V/3.3V/5.0V).
3. Not just RX and TX but RTS, CTS, DSR, and DTR are also provided.
4. The board can supply ~100mA of power. This power-sourcing capability helps make the setup easy when testing a board that doesn’t need much power.
5. It provides Galvanic Isolation. Both Power and IOs are Isolated.
   

   Salient Features

   1. USB-C Port: To connect to a PC, one can use a USB-A to USB-C cable or even a USB-C to USB-C cable.
   2. USB to UART Bridge capable of up to 3Mbps
   3. Isolated Power, capable of up to 100mA. Short Circuit Protected.
   4. Isolated RX, TX, RTS, CTS, DTR, DSR, and all IOs are ESD-protected.
   5. Signal voltage level selection 1.8/2.5/3.3/5V via DIP Switch
   6. A 2-pin Jumper is provided to select if you want to power the target(Jumper ON) or if it will be self-powered.
   7. LED Indication for RX, TX, & Power
   8. A male 8-pin header (angled) comes in the package but is unsoldered.
   9. Compact Size: 30.5mm x 70.5mm

The post Industrial Grade Isolated USB to UART Converter appeared first on Electronics For You.

View more at https://www.electronicsforu.com/press-releases/industrial-grade-isolated-usb-to-uart-converter.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Tiny FPGA Development Board

The FPGA development board fits into a microSD slot for easy programming, suitable for wearables, IoT, and predictive modeling. 

The Signaloid C0-microSD from Cambridge-based Signaloid is a compact iCE40 FPGA development board designed to fit and be programmed directly through a standard microSD card socket. The core technology is currently offered as an FPGA image for the Lattice iCE40UP5K FPGAs, which are used in the development board.

The tiny FPGA development board is designed for engineers, developers, and researchers involved in FPGA development, edge computing, uncertainty analysis, and embedded systems. Its compact size and unique programming model make it suitable for applications in wearables, IoT devices, and predictive modeling. 

The development board features an FPGA, 128 Mbit of flash memory, 11 I/O signals, and two LEDs, all within the footprint of a microSD card. The LEDs are positioned near the top edge of the board, remaining visible when the board is inserted into a socket. Of the I/O pins, six are linked to the microSD interface, while the remaining five are accessible via surface mount pads on the board’s rear.

By inserting the C0-microSD into a host computer, it functions as a file-based device. Applications can communicate directly with the board or utilize the Operating System’s disk utilities. For instance, you can upload a new bitstream directly without needing an external programmer.

Users can also leverage the included Signaloid C0 RISC-V processor core with pre-built uncertainty algorithms for application integration. As the device operates as a microSD card, it is compatible with single-board computers or microcontrollers equipped with an SPI interface.

For further development, the company provides an accessory called the Signaloid SD-Dev carrier board. Measuring 57 x 57 millimeters, this board features a full-size micro-SD card socket, USB-C ports, micro HDMI, and additional connectors, facilitating expanded development and testing.

For more information, click here.

The post Tiny FPGA Development Board appeared first on Electronics For You.

View more at https://www.electronicsforu.com/special/tiny-fpga-development-board.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Smallest Portable Mini Fridge

A Mini Fridge that can work with any power bank and without using harmful CFC gases.

Ever heard of a 5V portable freezer? Yes, you heard it right. In this DIY we design a 5V portable freezer that is easy to carry even while traveling. 

A freezer/refrigerator/fridge work on the same principle i.e. Pumping heat from one system to another and thermally isolating both the systems so that the pumped heat from one system cools down.

Meanwhile, the other system keeps getting hotter. The system generally acts like a radiator and transfers heat to a sink which is often the environment. Hence the heat transfer from the target system to the environment is done. 

The same principle is used to make the 5V portable freezer. The heat is pumped using a thermoelectric generator. This can generate electricity based on the heat difference or it can pump the heat from one side to another side.

Also Check: Fridge Temperature and Humidity Indicator

While out on picnics or outdoor activities, having a cold drink is what everyone wishes for especially on a hot day, and hence we wish to have some cold storage or a mini fridge. Since these are only found in luxury cars and vanity vans, and apart from being expensive, the CFC gas is quite dangerous to our environment, especially the ozone layer. 

This freezer does not use a CFC gas system that causes harm. Also, it is portable and can operate even with less power. It can run on our phone’s power bank and battery. We can attach it to any car or bus to enjoy chilled drinks, ice cream, etc. on ours.

The freezer is portable and can be carried in a travel bag and set against the car dashboard. It works on a 5V-1.5A power source, like a power bank/battery/solar panel.

Bill of Material

Want to create your own Power Bank? Watch the complete video tutorial for Constructing a Power bank.

Designing Mini Fridge

The body of the freezer has to be thermally isolated as much as possible, hence that is designed first. Thermal isolation is much needed since any freezer works on the heat transfer principle, where heat is transferred from one system to another, making a part of the system much colder.

Since the heat is pumped to another system, it makes the temperature of the recipient increase, so if the thermal isolation is not good, heat continues to enter the system and it becomes hard to maintain the temperature inside the freezer. 

Here we use the PLA 3D printed design of the freezer case and isolate it with thermal isolating material like Polystyrene/thermal isolator spray and paint. For the body of the freezer, one side of the box is kept open while the other 3 are closed. The open side is for inserting the heatsink and thermoelectric cooler module. 

Fig 1. Mini Fridge body

Fig 2. Mini Fridge top part 

Mini Refrigerator Circuit Connections

The components are connected according to the circuit diagram. The red wire is connected as a +ve wire of the thermoelectric cooler and fan with a 12V power source (battery). The -ve wire is connected with the -ve terminal of the battery and to the -ve wire of the thermoelectric cooler and 12V fan.

The next step is to fix the 3D printed parts and cover the edges with thermal insulator spray foam. Then the door of the freezer is added. A same-size transparent acrylic sheet is cut out and then fixed, such that using a magnetic-based lock system, we can use the door for opening and closing. Magnets are also fixed, on the door and fridge on the body as in Fig 6.

Fig 3 . Thermoelectric TEC Peltier connection for mini fridge

Fig 4. Components used for designing a mini-fridge

Fig 5. Mini Fridge in Action

Fig 6. Attached magnet within the mini fridge

The heatsink and fan are fixed, after which the thermal paste is added and sandwiched between the thermoelectric cooler module and the heatsinks. The fan is added next to the top of the big heat sink fan as in shown in the figures below. (Refer Fig. 7, 8, 9, 10, 11, 12).

Fig 7

Fig 8.The thermal paste on a heat sink 

Fig 9. Thermoelectric fixed and sandwiched between the heatsink

Fig 10. Fan added to heatsink fin

Now the heatsink fan is fixed on the top of the refrigerator while inserting the smaller heat sink inside the refrigerator case. Warm the cut part of the refrigerator body and keep the fan exposed on the other side of the refrigerator. (Refer Fig 13,14,15,16).

Fig 11. The fin fixed on the top part of the refrigerator body

Fig 12. The small heatsink fin fixed inside the refrigerator body

Fig 13. Fan exposed to open

Fig 14. Refrigerator ready after fixing components.

Also Check: Mini Fridge with Peltier Modules

Testing

Fig. 16

Fig 15

Now power the freezer, which means the fan and thermoelectric cooler will now wait for a few minutes. The heat is now transferred from the inside of the freezer to the outside, making the inside cooler. After 15 minutes the freezer temperature goes down to around 0 degrees Centigrade, making it ready to use.

Your portable freezer is now ready to use and chilled water, ice, beer, and cool drinks can be stored. It can also be carried around anywhere you go, be it for picnics, outings, hiking or can be fixed in the car.

The post Smallest Portable Mini Fridge appeared first on Electronics For You.

View more at https://www.electronicsforu.com/electronics-projects/portable-mini-fridge.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed