Smart Timer For Liquid Electronic Mosquito Repellents

As the hazards of mosquitoes are increasing day by day, the usage of liquid (electric) mosquito repellents is on the rise as well. These devices are widely employed for ensuring a good night’s sleep and are also commonly found in offices to enhance work environments.

Most liquid mosquito repellents are ruggedly constructed and operate continuously once activated. But the continuous operation of these mosquito repellents causes the vapour content in the room to exponentially increase over time, which can cause harmful breathing effects and allergic reactions.

Fig. 1: Liquid Mosquito Repellents Smart Timer

The smart timing operation for liquid mosquito repellents addresses this issue, offering different modes suitable for residential and office purposes. The author’s prototype is shown in Fig. 1, with the required components listed in Table 1.

Table 1: Bill of Materials
Components	Quantity
Arduino Uno board (MOD1)	1
DS1307 RTC module (MOD2)	1
One channel 5V relay module	1
10-kilo-ohm resistor (R1, R2, R3)	3
On/off switch (S1 through S4)	4
12V DC adaptor	1

Liquid Mosquito Repellents Timer – Circuit and Working

The circuit diagram of the smart timer for liquid mosquito repellents is shown in Fig. 2. It is built around the Arduino Uno board (MOD1), RTC DS1307 module (MOD2), 5V relay module, 5V buzzer (B1), and a few other components.

The positive terminal of the buzzer (B1) is connected to pin D13 of the Arduino Uno, with its ground pin connected to the Arduino ground. A 12V DC adaptor that powers the circuit is directly connected to the DC socket on the Arduino Uno board.

Fig. 2: Circuit diagram

The relay’s normally-open (NO) pins are connected to a 220V AC, 6A electrical socket, which is also used to connect the liquid mosquito repellents. An additional 6A SPST electrical switch (S4) is connected across the NO and COM pins of the relay module, which acts as a bypass switch whenever a smart switching action is not needed. Images of the DS1307 I2C RTC module and the 5V relay module are given in Fig. 3 and Fig. 4, respectively.

Fig. 3: DS1307 I2C RTC module

The Arduino board, which is the heart of the system, is central to the real-time clock, mode selection switches, and the 5V relay board. The main purpose of the timer is to regulate the on/off cycles of the liquid mosquito repellent according to different modes of operation.

Fig. 4: One-channel 5V relay module

For convenience, it has seven modes that can be selected by three switches.

Mode 1: Night mode: In this general-purpose mode, the controller automatically switches on the mosquito repellent from 6:00 pm to 6:00 am for uninterrupted sleep. To enable this mode, keep switches S1, S2, and S3 open.

Mode 2: Night toggle mode: In this mode, the timer switches on the repellent continuously from 6:00 pm to 00:00 hours, then toggles from 00:00 hours to 6:00 pm, every hour. To enable this mode, close switch S1 and keep switches S2 and S3 open.

Mode 3: Night toggle mode with buzzer: It is similar to mode 2, but has an added feature of a buzzer acting as a wake-up alarm at 6:00 am. To enable this mode, close switch S2 and keep switches S1 and S3 open.

Mode 4: Office mode: In this mode, it operates continuously during office hours from 10:00 am to 6:00 pm, which is suitable for open office rooms. To enable this mode, close switches S1 and S2 and keep switch S3 open.

Mode 5: Office toggle mode: The repellent switches on and off hourly during office hours from 10:00 am to 6:00 pm, which is suitable for closed, air-conditioned office rooms. To enable this mode, close switch S3 and keep switches S1 and S2 open.

Mode 6: Hall mode: This mode is for use in halls during evening gatherings to keep the repellent switched on from 5:00 pm to 10:00 pm. To enable this mode, close switches S1 and S3 and keep switch S2 open.

Mode 7: All-day toggle mode: This mode operates the repellent continuously but non-sequentially, switching on and off every hour, which is ideal for office rooms operating 24/7. To enable this mode, keep switch S1 open and switches S2 and S3 closed.

The seven modes are controlled by push-to-on switches S1, S2, and S3, as shown in Fig. 1. These switches (S1 through S3) are simple on/off switches connected in series with the resistor between the 5V and the ground pin of the Arduino board.

Green boxes in Table 3 indicate the on-time of the liquid mosquito repellent. These switches are connected to the Arduino board pins as shown in Table 2. The positions of the switches and the corresponding modes of operation are shown in Table 3.

Table 2: Arduino Uno pin connections with other components
Arduino Uno Pins	Components such as RTC module, switches, buzzer, etc.
5V pin	DS1307 I2C RTC module VCC pin
5V pin	2nd pins of S1, S2, S3
5V pin	Connected to VCC pin of relay module
Pin D2	1st pin of S3
Pin D3	1st pin of S2
Pin D4	1st pin of S1
A4	SDA pin of DS1307 I2C RTC module
A5	SCL pin of DS1307 I2C RTC module
Pin D11	Input signal pin of relay module
Pin D13	Buzzer positive pin
GND	GND pin of relay module
GND	One end of resistors R1, R2, R3
GND	GND pin of buzzer
GND	GND pin of DS1307 I2C RTC module

Table 3: Modes of operation
TIME IN HOURS					6	7	8	9	10	11	12	13	14	15	16	17	18	19	20	21	22	23	00	1	2	3	4	5
MSB		LSB
S3	S2	S1
PIN 2	PIN 3	PIN 4	MODE
0	0	0	1	NIGHT MODE
0	0	1	2	NIGHT SMART TOGGLE
0	1	0	3	NIGHT SMART WITH BUZZER																								BUZZER AT 05:59:55 sec
0	1	1	4	OFFICE MODE
1	0	0	5	OFFICE TOGGLE
1	0	1	6	HALL MODE
1	1	0	7	ALL DAY TOGGLE MODE

Arduino Code for Liquid Mosquito Repellents Timer

The circuit operation is governed by the software program loaded into the internal memory of the Arduino Uno. The program, written in Arduino programming language, is uploaded using the Arduino IDE. The sketch initializes input and output pins and utilizes the wire library for communication with the DS1307 RTC module. Serial communication allows for monitoring of time and working mode.

The following functions and libraries are used.

Serial.begin(): Establishes serial communication between Arduino Uno board and another device, via a USB cable. It permits the two devices to communicate using a serial protocol. Here serial communication is used only to just read the data from Arduino Uno onto the screen. The displayed data allows us to know the time and working mode.

The following header files are used in the main code.

#include <Wire.h>: The Wire library allows to communicate through I2C devices, also called ‘2 wire’ or ‘TWI’ (two wire interface). The SDA (data line) and SCL (clock line) are used for communicating with the DS1307 RTC module.

#include “RTClib.h”: Used for communicating with the DS1307 RTC module. In the next step, initialize the relay pin as output.

Serial.begin(9600): Used for serial communication. For displaying the time on the serial screen, it is used for just reference purposes.

Two methods of setting the time into the RTC module

Method 1:

rtc.adjust(DateTime(F(__DATE__), F(__TIME__))); This line sets the time according to your computer time. It will set the present clock time of your system into the DS1307 I2C RTC module.

Method 2:

rtc.adjust(DateTime(2021, 7, 21, 10, 0, 0)); This command will set the time into the RTC module in this format (year, month, date, hours, minutes, seconds.) (for example: 2021, July, 21, 10:00:00 am). Once the time is set, the backup battery in the RTC module keeps the time for a long time.

Construction and Testing

Upload the source code into the Arduino Uno board, ensuring proper timing settings as indicated in the source code. Assemble the circuit on a breadboard and connect the 12V DC power adaptor to the barrel jack on the Arduino. Select modes using switches S1 through S3. The relay will energize and de-energize based on the selected modes, controlling the liquid mosquito repellent accordingly.

For manual operation or bypassing the circuit, remove the 12V power supply from the Arduino Uno board and use switch S4. Close switch S4 for manual activation and open it for manual deactivation of the liquid mosquito repellent.

Download Source Code

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K. Murali Krishna is working as a JTO, BSNL, 4G saturation project in Vishakapatnam. He is a technical enthusiast, writer, and an embedded systems and circuit designer

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Curated by Jesif Ahmed

Class D Audio Amplifier Reference Design

The audio amplifier reference design is efficient for rapid prototyping on microcontroller platforms, enhancing audio performance.

Class-D audio amplifiers are highly valued for their efficiency, often exceeding 90%, which makes them ideal for battery-operated devices and applications where heat dissipation is a concern. Unlike traditional amplifiers that waste a significant portion of their energy as heat, Class-D amplifiers convert most of their power input into audio output, reducing energy costs and improving sustainability. Their compact size and lower heat generation allow for smaller, more portable designs. Moreover, the high efficiency of Class-D amplifiers doesn’t compromise sound quality, making them suitable for both consumer electronics and professional audio systems. The 1kW Class-D Audio Amplifier reference design from NXP Semiconductors is a model for constructing an audio amplifier with a push-pull power converter. It operates on the Kinetis KV1x Tower series platform. This design utilizes the internal FlexTimer module to modulate the input analogue audio in a Class-D format and generate PWM signals to control the switching push-pull power supply.

The 1kW Class-D Audio Amplifier boasts several features that streamline its design and enhance its performance. It enables rapid prototyping using either the Tower System module or the Freedom System platform, essential for capturing analog audio input, generating Class-D audio output, and controlling the push-pull power supply. The amplifier comes with embedded source code, allowing for the quick and cost-effective construction of a Class-D audio amplifier. Additionally, the FlexTimer manages the gate drivers for the power MOSFETs, incorporating several protections such as dead-time insertion, fault control, initialization, and polarity control. This efficient design minimizes CPU load, freeing up the processor for further application enhancements.

The FlexTimer feature in the system controls the gate drivers for power MOSFETs, adding several layers of protection, including dead-time insertion, fault control, initialization, and polarity control. This setup ensures operational safety and reliability while minimizing the CPU load. As a result, more processor resources remain available for enhancing and expanding applications.

The tools and software required for operation include the TWR-KV10Z32 module and the Kinetis Design Studio version 3.0.0 or higher. These components are essential for the system’s setup and functionality.

NXP has tested this reference design. It comes with a bill of materials (BOM), schematics, a design file, etc. You can find additional data about the reference design on the company’s website. To read more about this reference design, click here.

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ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI

Arm Targets the AIoT with High-Performance Ethos-U85 NPU and Corstone-320 Platform New accelerator boasts four times...

The post ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI appeared first on Electronics-Lab.com.

View more at https://www.electronics-lab.com/arm-unveils-ethos-u85-npu-and-corstone-320-platform-for-enhanced-edge-ai/.

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Curated by Jesif Ahmed

Mastering Electrical Connectivity: From Circuit Topology to Switching Classifications

This technical article aims to delve into various aspects of electrical connectivity, symbol representation, and isolation methodologies, shedding light on fundamental concepts and practical applications within the field. From the... Read more


The post Mastering Electrical Connectivity: From Circuit Topology to Switching Classifications appeared first on EEP - Electrical Engineering Portal. Credit: EEP- Electrical Engineering Portal. Visit:


http://dlvr.it/T6TJ4j

Mastering Electrical Connectivity: From Circuit Topology to Switching Classifications

This technical article aims to delve into various aspects of electrical connectivity, symbol representation, and isolation methodologies, shedding light on fundamental concepts and practical applications within the field. From the... Read more

The post Mastering Electrical Connectivity: From Circuit Topology to Switching Classifications appeared first on EEP - Electrical Engineering Portal.

View more at: https://electrical-engineering-portal.com/electrical-connectivity-circuit-topology-switching-classifications Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

Indusboard-Based Smallest GPS Tracker

GPS tracking is one of the most important technologies in today’s world. From parcel updates to navigation and many different fields, we rely on GPS.

However, if we want to track smaller items such as baggage or monitor the location of children, or if we intend to monitor someone discreetly, we often require a compact and inconspicuous device that can be easily attached without occupying much space.

Today, we will design the smallest GPS tracker that you can use as a key ring or attach as a small tag to bags to track children, affix to the necks of animals, or integrate with vehicles, parcels, or individuals for tracking purposes.

In our design, the primary requirement is to maintain a compact size within 3cm. Therefore, we opted for the Indusboard Coin as the base.

Additionally, to ensure the GPS unit remains small, we selected the L86 GPS module, measuring only 1.5 cm and equipped with an integrated GPS antenna.

For transmitting data via GSM, we incorporated the SIM800l module, which operates on the 2G band. However, if higher network speeds are desired, it’s possible to substitute this with a 4G or 5G GSM module.

Bill of Material

Fig 1. Parts List

Indusboard-based Smallest GPS Tracker – Design

In our design process, we decided to use the L86 GPS module. It communicates through a serial port with a speed of 9600 baud. The Indusboard, which we’re using, supports both software and hardware serial.

We can configure any pins for this purpose, but by default, pins 43 and 44 serve as RX and TX serial pins on the board. So, we’re using this hardware serial connection for the L86 GPS.

The L86 GPS module needs power in the range of 2.8V to 4V, and it typically uses around 100mA when it’s working. Luckily, the board we’re using already has a pin that can handle this power. So, we’re connecting the GPS module to the 3.3V and GND pins on the Indusboard for power.

Fig 2. GPS powering system details – L86 GPS module Features

The GPS module comes with an RTC backup power pin. This feature, according to the datasheet, allows the Real-Time Clock (RTC) to keep track of time even if the main power is disconnected. Typically, you can attach any 3.3V coin cell battery to this pin for backup power.

However, in our design, we decided to simplify things by using the same voltage source for the main power and the RTC backup. So, we’re connecting this RTC backup power pin to the same 3.3V source that powers the GPS module.

Fig 3. L86 GPS module pinout (Source datasheet of L86 GPS module)

Next, we incorporated the GSM module into the design. Most GSM modules, including the SIM800l, SIM808, and others, also utilize serial communication. For this purpose, we designated pins 43 and 41 as the serial pins.

Like the GPS module, we powered the GSM module using the same 3.3V and GND power supply of the board.

Additionally, if you desire to view network status, receive SMS and access location coordinates such as latitude and longitude, you have the option to include the SSD1306 OLED display.

However, it’s important to note that this addition will increase both the bill of materials and power consumption of the device. Although not included here, our design accommodates this feature by providing the necessary connections for the SSD1306 OLED display.

Now you can solder all the components according to the circuit diagram. (Fig 4).

Fig 4. Connection diagram of Indusboard-based smallest GPS Tracker device

After soldering the components together, we’ll place the GSM module and secure it either on the top or bottom of the board. Similarly, we’ll position the GPS module in the same manner as depicted in Figure 5 and Figure 6.

Fig 5. Indusboard-based smallest GPS Tracker device

Fig 6. GPS tracker using Indusboard and L86 GPS module

Now you can design the keyring and tag case over the device and attach it anywhere to use it.

Fig 7. GPS tracker ring using Indusboard

Code for GPS Tracker using Indusboard

Firstly, we’ll install the Async message library. Then, we’ll define the serial pins and baud rates for both the GPS and GSM modules. The default baud rate for GSM is 4800, and for GPS, it’s 9600.

Next, we’ll create a function to retrieve the GPS location and send it to the predefined number at a one-minute time interval. You have the flexibility to adjust this time interval according to your requirements.

Additionally, you can implement features such as responding with a location map link when a specific message is received by the device. The code offers various customization options to tailor it to your needs.

Fig 8. Indusboard-based smallest GPS Tracker Programming

Testing Smallest GPS Tracker using Indusboard

Once the device is powered using a 3.3V rechargeable battery, insert a SIM card with a message pack into the GSM module. After a few minutes, when the SIM module establishes a connection with the network provider, it begins sending real-time location updates to your phone.

When you tap on the link received, you can view the location on Google Maps, providing you with accurate tracking information.

Fig. 9 – Indusboard-based GPS Tracking

Fig 10. GPS tracker showing the location of the device

Smallest GPS Tracker CodeDownload

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3D IC Solutions For RFSOI Technology

RF integration in modern devices, addressing the escalating bandwidth demands of 5G networks while laying the groundwork for future wireless communication systems.

In recent developments in the semiconductor industry, United Microelectronics Corporation (UMC) introduced a 3D IC solution tailored to radio frequency silicon on an insulator (RFSOI) technology. This solution, implemented on UMC’s 55nm RFSOI platform, facilitates reduction in die size by over 45% while maintaining optimal radio frequency (RF) performance. This advancement enables the seamless integration of additional RF components to meet the escalating bandwidth demands of 5G networks.

UMC conducted research in Hsinchu, Taiwan. The key development involves using wafer-to-wafer bonding technology, which enables the vertical stacking of dies to diminish surface area without compromising RF performance. This method effectively resolves the issue of RF interference between stacked dies, ensuring enhanced functionality.

The solution for RFSOI directly addresses the challenge posed by the growing complexity of RF front-end modules (RF-FEM) in modern devices, particularly smartphones. By vertically stacking dies, the solution optimizes space utilization, accommodating more frequency bands in parallel and facilitating seamless data transmission and reception. This breakthrough technology is not only crucial for the 5G/6G era but also holds significant implications for diverse applications including mobile, IoT, and virtual reality devices.

The team claims that this marks a significant milestone in the semiconductor industry. By effectively addressing the challenges associated with RF integration in modern devices, this technology not only enhances the performance of current applications but also lays the foundation for future advancements in wireless communication systems. With ongoing research and development efforts, they aims to further refine stacked die solutions to meet the evolving demands of RF technologies, ensuring continued innovation in the field.

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32-bit Microcontroller Enhances Security For Cybersecurity Requirements

By simplifying compliance and reducing the costs of embedding security, these microcontrollers are essential for protecting a wide range of digital applications against evolving threats. 

Microchip Technology Inc. has recently launched a new series of 32-bit microcontrollers, the PIC32CK family, featuring embedded security technologies. This launch comes at a critical time, as new legislation effective in 2024 intensifies cybersecurity requirements across a spectrum of digital applications, from consumer IoT devices to crucial infrastructure. The microcontrollers incorporate an integrated Hardware Security Module (HSM) and Arm Cortex-M33 core with TrustZone technology, designed to meet these stringent new mandates. This combination not only simplifies compliance but significantly reduces the cost and complexity associated with embedding top-tier security in product designs. The inclusion of HSM and TrustZone technologies offers robust security measures like secure boot, secure debug, and secure updates, crucial for protecting against evolving cyber threats.

The technical architecture of the microcontrollers ensures that they are well-equipped for modern security challenges. These technical features include:

• Supports various cryptography standards, both symmetric and asymmetric.
• Includes true random number generation and secure key management.
• Industry’s first 32-bit microcontroller to combine an HSM with TrustZone technology.
• Complies with ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards.
• Offers scalable security, memory, and connectivity options .
• Configurations offer up to 2 MB dual-panel Flash and 512 KB SRAM.
• Connectivity includes 10/100 Ethernet, CAN FD, and USB.

Rod Drake, corporate vice president of Microchip’s MCU32 and MPU32 business units, emphasized the timeliness and importance of this innovation: “Emerging requirements make security mandatory for the majority of IoT connected devices. It makes it cost-effective to provide hardware-based security to mid-range microcontroller applications.” He further highlighted thatthe company’s comprehensive ecosystem of tools and security expertise significantly aids customers in navigating these new regulations, ensuring sustained product lifecycle support. 

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Heat-Resistant Memory Technology For Extreme Environments

From deep-earth exploration to the depths of space, discover how this durable technology could power the future of AI and beyond.

When smartphones shut down during a beach day, it’s typically due to their electronic components failing to withstand the heat. This failure occurs because the memory chips aren’t designed to handle extreme temperatures, causing data loss as electrons destabilise and escape. Addressing this issue, researchers at the University of Pennsylvania’s School of Engineering and Applied Science have made a significant breakthrough.

Their teams developed a memory technology that endures temperatures up to 600° Celsius (1112° Fahrenheit). This temperature is more than double the threshold of commercial memory drives. Impressively, their device maintained stability for over 60 hours, suggesting a new benchmark in durability.

The new memory device uses ferroelectric aluminum scandium nitride (AlScN). Unlike traditional silicon-based memories, which fail around 200° Celsius (392° Fahrenheit), AlScN can retain data at much higher temperatures. It operates on a metal-insulator-metal structure featuring nickel and platinum electrodes and a strategically thin AlScN layer, only 45 nanometers thick. This configuration helps maintain efficient operation even as temperatures cause particles within the material to move erratically.

This advancement is not just about enhancing the resilience of memory storage. The researchers envision their technology enabling more sophisticated computing in extreme conditions, such as deep-earth drilling or space exploration, where conventional electronics would falter. For example, their device could drastically improve the efficiency of artificial intelligence (AI) systems that currently suffer from data transfer bottlenecks between the central processing unit and memory storage.

The team highlights another critical benefit of their invention: by integrating memory and processing units more closely, their “memory-enhanced compute” approach could eliminate inefficiencies inherent in traditional computing architectures. This integration could potentially allow high-performance computing in environments where even silicon carbide technology, a standard for high-temperature electronics, falls short.

The team’s innovation, with its potential to revolutionize fields from geothermal energy extraction to interplanetary exploration, opens up exciting possibilities for deploying advanced computing technologies in harsh environments. Their ongoing research aims to further integrate this technology with existing high-temperature computing systems, setting the stage for new applications that require durable, high-speed data processing. This could lead to significant advancements in fields such as deep-earth drilling, space exploration, and even artificial intelligence, demonstrating the broad impact of this breakthrough.

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Auxiliary Power Supply Reference Design

Streamlined design boosts operational efficiency, reliability, meeting rising demands in industrial and solar gear.

In response to the increasing requirements for efficient, reliable, and cost-effective offline Switch Mode Power Supplies (SMPS), particularly in industrial and solar settings, the development of a low-power (<100W) power converter with galvanic isolation becomes paramount. This auxiliary power supply plays a critical role in converting electric power from a High Voltage Direct Current (HV DC) bus to a Low Voltage (LV) source, powering essential control circuits, sensing circuits, cooling fans, and various equipment, ensuring optimal functionality and performance.

The design by Microchip offers efficient high-voltage (HV) to low-voltage (LV) conversion for LV subsystems, incorporating a single switch mode flyback topology with a 1700V mSiC MOSFET, which not only ensures efficient conversion but also protects against peak switching voltage and voltage fluctuations across the transformer leakage inductance. The design has a wide range of voltage inputs, from 250V to 1000V, paired with dual-voltage outputs of +24V/2A and +15V/1A, catering to diverse industrial and photovoltaic applications where voltage variations are prevalent. Key features include a single switch mode flyback topology, wide input voltage range, dual voltage outputs, and high power conversion efficiency. The integration of a single switch mode flyback topology enhances efficiency and reliability in HV to LV conversion, while the wide input voltage range ensures adaptability to diverse voltage variations. The provision of dual voltage outputs meets the multifaceted power requirements of various equipment and systems, while the high power conversion efficiency optimizes energy utilization and reduces operational costs through a current-mode Pulse-Width Modulation (PWM) controller-based closed-loop control.

The versatility and reliability of this power converter design make it suitable for a myriad of applications, including industrial motor drives, solar inverters, uninterruptible power supplies (UPS), general-purpose inverters, cascaded H-bridge converters, and modular multilevel converters. In conclusion, the integration of innovative features and robust design principles culminates in a power converter solution that addresses the evolving needs of industrial and photovoltaic applications, setting a benchmark for performance, reliability, and cost-effectiveness in the realm of SMPS technology.

Microchip has thoroughly tested this reference design, which includes Altium design files, a PLECS software model, a user guide, a Bill of Materials (BoM), and more. Additional information about the reference design can be found on the company’s website. For further details on this reference design, please click here.

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