New MIT process embeds matching hardware fingerprints in paired chips for direct, server-free authentication. Researchers at the Massachusetts Institute of Technology have unveiled a novel chip-fabrication technique that could reshape hardware-level security for electronic systems by enabling paired microchips to authenticate one another directly using shared physical identifiers. At the core of the approach is […]View more at https://www.electronicsforu.com/news/twin-chip-fabrication-for-electronics-security.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
MIT’s new fabrication trick gives paired chips matching physical IDs for secure, server-less authentication. In hardware security news, researchers at the Massachusetts Institute of Technology have developed a new chip-processing method that could tighten cryptographic security at the device level by creating paired physical fingerprints on microchips. This technique addresses a longstanding challenge in secure […]
APPLY HERE Location: Bengaluru Company: Tesla Position Description The Tesla AI Hardware team is at the forefront of revolutionising artificial intelligence through cutting-edge hardware innovation. Comprising brilliant engineers and visionaries, the team designs and develops advanced AI chips tailored to accelerate Tesla’s machine learning capabilities. Their work powers the neural networks behind Full Self-Driving (FSD), and Tesla humanoid robot, […]
What if robots could be trained in full digital factories before touching the real world? Can a simulation model make that possible? AuraML has introduced AuraSim, a multimodal world simulation model built to generate physics-ready environments for robotics. The platform converts inputs such as text, floorplans, videos, depth maps, and point clouds into simulation-ready digital […]
New nanoscale research reveals how molecular stiffness could cap the performance of flexible wearable tech. Researchers at University of Cambridge have taken a first experimental step toward understanding how the molecular mechanics of flexible semiconductors might constrain the performance of future wearable electronics suggesting there could be inherent limits to how fast and efficient bendable […]
The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die systems more efficiently in AI data centre applications. Keysight Technologies has introduced 3D Interconnect Designer, part of its EDA portfolio, to support the growing intricacy of chiplet and 3DIC packages. The software aims to streamline workflows […]
The new MIT platform uses multiple materials to fabricate complex electric motors in hours a potential game‑changer for on‑site electronics production. In a major advance for additive manufacturing and electronics fabrication, researchers at the Massachusetts Institute of Technology have demonstrated a 3D‑printing system capable of producing fully functional complex electric machines including a complete linear […]
What if one bench top instrument could handle wide frequencies, multiple parameters, fast measurements, and production sorting in a single setup? Find out! The BR 5812 from KUSAM-MECO is a versatile LCR meter built for engineers, technicians, and researchers who need fast, accurate, and reliable measurement of electronic components. It solves common problems like slow […]
MIT’s AI system boosts precision protein drug production, cutting development costs by learning the “language” of genetic sequences. In a move that signals deeper convergence between artificial intelligence and bio-manufacturing electronics, researchers at the Massachusetts Institute of Technology (MIT) have developed an advanced large language model-based tool that could significantly reduce the cost and effort […]
0.24 mm² low-power FMCW design targets 6G sensing-communication convergence in edge electronics. Tokyo scientists have unveiled a tiny radar-on-chip prototype that could reshape future wireless hardware for beyond-5G and 6G ecosystems, marrying sensing with communications in a power-lean design. Developed at Japan’s Institute of Science Tokyo, the new chip packs a high-precision Frequency-Modulated Continuous-Wave (FMCW) […]