Smart Dry Adhesive For Precision Electronics

Researchers at POSTECH have developed a dry adhesive using shape memory polymers that enables precise pick-and-place of micro-LEDs and everyday materials—without glue or residue, this could transform display manufacturing and smart assembly systems. A research team from Pohang University of Science and Technology (POSTECH) has introduced a dry adhesive technology that enables easy attachment and […]

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Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed