Advanced convection architecture and smart power control aim to raise profiling precision while cutting operating costs in high-mix SMT lines. A new 16-zone reflow oven configuration by Kurtz Ersa is positioning itself as a high-performance option for electronics manufacturers seeking tighter thermal control and improved process efficiency in surface-mount production. The HOTFLOW THREE platform integrates […]View more at https://www.electronicsforu.com/news/16-zone-reflow-platform-targets-higher-thermal-stability.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
