Storage Without Cables

Built for cross device workflows, the SSD addresses portability, compatibility, and speed challenges faced by users handling large files daily. As content creation increasingly moves across laptops and smartphones, users are looking for simple and reliable ways to move and back up data without relying on cables, adapters or cloud connectivity. Traditional external drives often […]

View more at https://www.electronicsforu.com/news/storage-without-cables.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Electronics Drives Higher Efficiency Industrial Solar Cells

TOPCon silicon solar cells achieve over 26% efficiency while significantly reducing silver usage and boosting bifacial performance showing how incremental manufacturing innovations can deliver both higher output and lower material costs at scale. A research team led by the Ningbo Institute of Materials Technology and Engineering (NIMTE) has reported industrial-grade TOPCon silicon solar cells with […]

View more at https://www.electronicsforu.com/news/electronics-drives-higher-efficiency-industrial-solar-cells.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Interesting Facts About the Eight Most Common Distribution Network Faults

There are numerous possible reasons for electrical power to go out. This story presents the interesting facts about the eight most common faults in the MV and LV distribution systems, which include vehicles hitting poles, trees touching or falling on... Read more

The post Interesting Facts About the Eight Most Common Distribution Network Faults appeared first on EEP - Electrical Engineering Portal.




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Curated by Jesif Ahmed.

“Many Companies Underestimate The Learning Curve And Invest In Partial Setups Without Fully Understanding Test Requirements” – Rahul Gautam, Exeliq

Rahul Gautam, Co-Founder of Exeliq Tech SolutionsWhat does it take to build a reliable EV test lab in an industry where technology changes every few months? Delving into answers, challenges, and solutions, Rahul Gautam of Exeliq speaks with EFY’s Vidushi Saxena about helping OEMs build smart, scalable labs. Q. Can you tell me about the company Exeliq? A. Exeliq is a test and measurement automation company […]

View more at https://www.electronicsforu.com/technology-trends/many-companies-underestimate-the-learning-curve-and-invest-in-partial-setups-without-fully-understanding-test-requirements-rahul-gautam-exeliq.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Field Application Engineer II At TE Connectivity In Delhi And Pune

APPLY HERE Locations: Delhi and Pune Company: TE Connectivity In this role, you will partner with focused TE Connectivity Customers within, High performance Communication and Wireless, Networking, Compute and the IoT markets. It is an exciting opportunity to work at the forefront of next-generation communication technology. The FAE will serve as a technical resource for our […]

View more at https://www.electronicsforu.com/career/field-application-engineer-ii-te-connectivity-delhi-pune.

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Curated by Jesif Ahmed

Jetson Powered Edge AI Vision Box 

A rugged edge AI vision box built on NVIDIA Jetson technology targets autonomous systems with high AI throughput, multi-camera support, and cloud-based device management. A new edge AI vision box by e-con systems aimed at production-grade autonomous and vision-driven systems has been unveiled, combining high-performance AI compute with deep camera and sensor integration in a […]

View more at https://www.electronicsforu.com/news/jetson-powered-edge-ai-vision-box.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Sensing The Flow Right

Sensors for medical and lab designers for fast, stable, easy to integrate and control tiny liquid flows where accuracy directly shapes results. In medical, life science, and microfluidic systems, liquid flow accuracy plays a critical role in determining performance and outcomes. A slight variation in flow can lead to dosing errors and wasted reagents.. As […]

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Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Indoor Positioning Using BLE and Wi‑Fi Triangulation: Real‑Time Indoor Tracking

Fig 2. Trilateration method for positioning and calculationStruggling with GPS indoors? Learn how to build a DIY real-time indoor tracking system using BLE and Wi‑Fi triangulation. Track people, pets, or robots with accuracy and see positions live on your device. Indoor navigation is becoming increasingly important across many applications—from wearables and indoor tracking systems to monitoring pet movement. It also plays a […]

View more at https://www.electronicsforu.com/electronics-projects/indoor-tracking-ble-wifi-triangulation.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

The Rise of Harmonic Distortion in Modern Power Systems

Modern power systems are undergoing a profound transformation. The rise of harmonic distortion is becoming a huge problem. The traditional grid once dominated by large synchronous generators and linear loads—has evolved into a complex, inverter-rich network driven by renewable generation,... Read more

The post The Rise of Harmonic Distortion in Modern Power Systems appeared first on EEP - Electrical Engineering Portal.




View more at: https://electrical-engineering-portal.com/rise-of-harmonic-distortion-in-modern-power-systems Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

Ultra-Thin Materials Bring 3D Chips Closer

A new material, a cooler process, and a stacked design: MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy. In a development that could reshape how future chips are built, MIT researchers have demonstrated a fabrication technique that stacks logic and memory directly on top […]

View more at https://www.electronicsforu.com/news/ultra-thin-materials-bring-3d-chips-closer.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Engineer II, Process At CommScope In Goa

APPLY HERE Location: Goa Company: CommScope General Summary: responsible for optimizing manufacturing processes to improve efficiency, quality, and cost-effectiveness by developing new processes, analyzing data, and solving production problems. Key duties include creating and updating work instructions and process documentation, collaborating with cross-functional teams, managing process improvement projects, ensuring safety and environmental compliance, and supporting the […]

View more at https://www.electronicsforu.com/career/engineer-ii-process-commscope-goa.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Why Traditional SBCs Fail And What The Next Generation Fixes

Unlike traditional SBCs, the new edge boards blend CPU, GPU, and NPU in one hybrid system. From robotics to outdoor IoT, a fresh architecture is promising speed and rugged reliability. But what makes it possible? Edge computing is changing fast, much faster than most engineers ever imagined. And as industries rush to push AI closer […]

View more at https://www.electronicsforu.com/special/why-traditional-sbcs-fail-and-what-the-next-generation-fixes.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Ultrafast Full Wafer Thickness Mapping

A new film-thickness measurement system promises to collapse wafer inspection times  delivering full 300 mm-wafer thickness maps in under a heartbeat and boosting throughput for semiconductor fabs. The latest entrant to wafer metrology is a thickness measurement device from Hamamatsu Photonics that promises to transform semiconductor process control. The new system delivers full-surface thickness distribution […]

View more at https://www.electronicsforu.com/news/ultrafast-full-wafer-thickness-mapping.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Hardware Engr I At Honeywell In Bengaluru

APPLY HERE Location: Bengaluru Company: Honeywell As a Hardware Engineer I, here at Honeywell, you will be responsible for supporting the hardware design process from concept to production. You will work closely with senior engineers to define hardware requirements and specifications, assist in the design of hardware systems, including schematic capture and PCB layout, and […]

View more at https://www.electronicsforu.com/career/jobs/hardware-engr-honeywell.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

AI Automation Enters Logistics Frontlines

A new class of trailer-clearing robots is stepping into dock doors, using vision and generative AI to automate one of logistics’ toughest, highest-injury tasks at industrial speeds. Autonomous unloading robots are quickly becoming a fixture at U.S. logistics hubs, taking on one of the most physically punishing jobs in the supply chain: clearing packed trailers […]

View more at https://www.electronicsforu.com/news/ai-automation-enters-logistics-frontlines.

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Curated by Jesif Ahmed

Making Compact IoT Devices Easier

Are you struggling to build small, smart industrial devices? A compact solution can make integration easy, adds AI at the edge, and keeps software secure for years. Many industrial IoT developers face challenges with building compact, reliable devices that still offer flexibility for future upgrades. Space constraints, integration complexity, and the need for long-term software […]

View more at https://www.electronicsforu.com/news/making-compact-iot-devices-easier.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Edge AI For Small Industrial Devices

Are you facing challenges in making small industrial devices? A tiny module can handle AI, stay reliable and simplify software. Read on! We might face many challenges when building industrial IoT devices. Space is always limited, yet performance cannot be compromised. Devices need to work reliably in extreme temperatures and scale efficiently in high-volume production. […]

View more at https://www.electronicsforu.com/news/edge-ai-for-small-industrial-devices.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

A Practical Guide to the Operation of Ring Main Units

Ring Main Units are compact modules that are gas-insulated and sealed, comprising main switching devices and ancillary components to ensure continuous secondary power distribution. The precise arrangement and configuration of components always depend on the particular application and loading conditions.... Read more

The post A Practical Guide to the Operation of Ring Main Units appeared first on EEP - Electrical Engineering Portal.




View more at: https://electrical-engineering-portal.com/practical-guide-to-operation-ring-main-unit Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

AI System Delivers Glasses Free 3D System

A new AI-driven light-field technique breaks long-standing limits in autostereoscopic displays, bringing wide-angle, glasses-free 3D closer to desktop deployment. A research team in Shanghai has unveiled an autostereoscopic display system that delivers full-parallax, glasses-free 3D on a desktop-scale screenan achievement long considered out of reach due to the constraints of optical physics. The prototype, detailed […]

View more at https://www.electronicsforu.com/market-verticals/ai-system-delivers-glasses-free-3d-system.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

SiC MOSFETs For Ultra Slim Power Systems

A new family of SiC MOSFETs delivers higher thermal performance, increased voltage headroom, and a significantly slimmer footprint aimed at AI servers, PV inverters, ESS units, and next-generation high-density power supplies. As data-center power architectures, AI servers, and compact renewable-energy systems race toward higher power levels, designers are pressed to shrink form factors without compromising […]

View more at https://www.electronicsforu.com/news/sic-mosfets-for-ultra-slim-power-systems.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

High-Speed Mini External Storage

Now you can transfer large files, videos, and photos in seconds. A portable storage can work across multiple devices anytime, anywhere. Transferring large files, high-resolution videos, and photo libraries can be slow and frustrating, especially for business professionals, content creators, and everyday users who rely on fast, reliable storage. Traditional external drives often struggle to […]

View more at https://www.electronicsforu.com/news/high-speed-mini-external-storage.

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Curated by Jesif Ahmed

Low-Power Monitoring For Battery-Driven Systems

If every bit of power matters, how do you measure it without wasting it? A new approach solves this and could change how devices are designed. When you design the battery-powered or energy-constrained systems you might face a constant trade-off. These devices need accurate power measurement to manage runtime, safety, and performance, but measurement itself […]

View more at https://www.electronicsforu.com/news/low-power-monitoring-for-battery-driven-systems.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Engineer II – Design At Microchip In Bengaluru

APPLY HERE Location: Bengaluru Company: Microchip As part of the MCU SoC Design Group, the successful candidate will be responsible for Design / Integration of ARM based micro-controllers. The candidate will interact regularly with cross-site teams to achieve the following goals: Requirements/Qualifications

View more at https://www.electronicsforu.com/career/engineer-ii-design-microchip-bengaluru.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Simplifying High-Speed Signal Generation

Generating many high-speed signals is hard and expensive. AWGs put up to 12 channels in one device, making setups easier and cutting costs. If you are in the field of semiconductor testing, quantum computing, communications, medical imaging, or industrial electronics, you might face challenges generating multiple high-speed, synchronized signals. Using several single-channel waveform generators can […]

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Curated by Jesif Ahmed

High Voltage SiC Devices

SiC portfolio pushes reliability and efficiency benchmarks for solid-state transformers, utility-scale storage, renewable infrastructure and megawatt-class fast-charging, backed by advanced packaging and extended qualification. Navitas has introduced a new line of 3300V and 2300V ultra-high-voltage (UHV) silicon carbide (SiC) devices aimed at mission-critical energy systems, targeting sectors such as AI data-center power delivery, utility-scale storage, […]

View more at https://www.electronicsforu.com/news/high-voltage-sic-devices.

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Curated by Jesif Ahmed

Powering Devices From Indoor Light To Sunlight

Devices often waste the light around them. A chip helps hybrid solar cells turn any light, indoors or outdoors, into power, keeping devices running longer. Many portable and stationary devices struggle to make the most of available light for power, especially when lighting conditions vary widely, from dim indoor environments to bright outdoor sunlight. Traditional […]

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Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

High-Performance Antennas For Compact Devices

Devices are getting smaller, but they still need strong connections. These tiny antennas make Wi-Fi, UWB, and IoT devices work reliably in small spaces. As devices get smaller and more connected, engineers face growing challenges in fitting high-performance antennas into ultra-compact electronics. Space constraints, interference from multiple radios, and the need for reliable connectivity across […]

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Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Stronger Muscle-Powered Robots

Artificial tendons make muscle-powered robots stronger and faster. They can last longer and work in tricky or dangerous places. Biohybrid robots often face a key limitation: their muscle-powered motion is weak and slow. Soft muscle tissue is difficult to attach to rigid skeletons efficiently, and much of the force is lost at connection points. The […]

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Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Ultra Low Noise Stereo DAC 

A new high-dynamic-range DAC enters the market with studio-grade noise performance, wide temperature tolerance, and compact packaging aimed at precision audio playback and embedded pro-audio gear. Nuvoton has unveiled its latest high-performance digital-to-analog converter (DAC), the NAU8421YG, targeting hi-fi and pro-audio playback and recording systems.  It is a 24-bit stereo DAC, capable of delivering an […]

View more at https://www.electronicsforu.com/news/ultra-low-noise-stereo-dac.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Five Construction Issues That Do Not Follow the Engineering Design (And Why They Matter)

High-voltage substations—especially modern AIS/GIS installations up to 400 kV—are engineered with extreme precision. Every cable, conductor, grounding conductor, insulator, and steel structure is designed according to exact assumptions: soil models, thermal limits, mechanical forces, environmental conditions, lightning protection angles, and... Read more

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View more at: https://electrical-engineering-portal.com/five-construction-issues-that-do-not-follow-the-engineering-design Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.