A new film-thickness measurement system promises to collapse wafer inspection times delivering full 300 mm-wafer thickness maps in under a heartbeat and boosting throughput for semiconductor fabs. The latest entrant to wafer metrology is a thickness measurement device from Hamamatsu Photonics that promises to transform semiconductor process control. The new system delivers full-surface thickness distribution […]View more at https://www.electronicsforu.com/news/ultrafast-full-wafer-thickness-mapping.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
