A new material, a cooler process, and a stacked design: MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy. In a development that could reshape how future chips are built, MIT researchers have demonstrated a fabrication technique that stacks logic and memory directly on top […]View more at https://www.electronicsforu.com/news/ultra-thin-materials-bring-3d-chips-closer.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
