Liquid cooling is no longer optional for AI infrastructure, but reliability at connection points is emerging as the next bottleneck. As AI workloads and high performance computing continue to drive chip power densities higher, traditional air cooling methods are approaching their physical limits. Liquid cooling has rapidly moved from an experimental option to a core […]View more at https://www.electronicsforu.com/news/precision-interfaces-for-ai-liquid-cooling.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
