By stacking active devices above existing circuitry, the platform reduces data transfer energy while increasing integration density and performance. Growing computational workloads are increasing energy losses caused by constant data transfer between logic and memory in conventional microelectronic architectures. As device scaling slows, reducing interconnect energy and improving integration density have become critical for sustaining […]View more at https://www.electronicsforu.com/news/3d-chip-architecture-cuts-energy-and-latency.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
