By using embedded metalenses to project holograms, the method achieves precision down to fractions of a nanometer—paving the way for cost-effective 3D chip production and opening new possibilities for compact sensors and startup innovations. Traditionally, semiconductor chips are built in two dimensions, limiting further technological advancement. To push beyond this boundary, manufacturers are turning to […]
View more at https://www.electronicsforu.com/news/3d-semiconductor-chip-alignment-using-lasers.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
