Tessent Multi-die software solution can help simplify critical design-for-test (DFT) tasks for complex integrated circuits (ICs) based on 2.5D and 3D architectures. The quest for developing compact and energy-efficient devices has led designers to create more power-efficient and power-dense ICs. These next-generation devices are made possible by employing 2.5D and 3D architectures that connect dies […]
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