Indium Corporation and SAFI-Tech have announced the launch of a new supercooled BiSn solder paste using SAFI-Tech’s innovative solder platform. Using SAFI-Tech’s platform, liquid metal is encapsulated in a proprietary soft shell, keeping the solder alloy in a sub-cooled (liquid) state far below its normal melting/freezing point. The shell of these powder-like microcapsules can be removed using […]
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