Notes in preparation of an MV/LV substation civil drawings and construction layout

MV/LV substations are not only a point of supply but also provide a means of network isolation in the event of faults or emergencies. In that manner, a detailed substation... Read more

The post Notes in preparation of an MV/LV substation civil drawings and construction layout appeared first on EEP - Electrical Engineering Portal.




View more at https://electrical-engineering-portal.com/mv-lv-substation-civil-drawings-construction-layout.
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LoRaWAN Gateway for the Internet of Things

With the UG85, ICP Germany launches an intelligent and compact indoor LoRaWAN gateway that can be...

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View more at https://www.electronics-lab.com/lorawan-gateway-internet-things/.
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VersaLogic embeds performance, security and resilience in new “Owl” embedded computer

VersaLogic Corp., the embedded industry’s most trusted computer company, has announced a new compact and rugged...

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View more at https://www.electronics-lab.com/versalogic-embeds-performance-security-resilience-new-owl-embedded-computer/.
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I²CMini – A tiny USB to I²C bridge that is compatible with I²CDriver

I²CMini is a USB to I²C bridge. It can drive and monitor I²C traffic and measures...

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View more at https://www.electronics-lab.com/i%c2%b2cmini-tiny-usb-i%c2%b2c-bridge-compatible-i%c2%b2cdriver/.
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FLIR Lepton Breakout v2.0 with Lepton 3.5

This is the brand new FLIR version of the Lepton Breakout Board. It is a very...

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View more at https://www.electronics-lab.com/flir-lepton-breakout-v2-0-lepton-3-5/.
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What Are The Differences Between SMD, SMT and THT?

Fundamentally, there is a difference between surface-mount technology (SMT) and surface-mount device (SMD). It is because one is a process, whereas the other is a device. SMT is the method of placing components (like an SMD) on the board. Here, a calculated amount of solder paste is applied to the board. Then, the pick-and-place machine […]

The post What Are The Differences Between SMD, SMT and THT? appeared first on Electronics For You.



View more at https://electronicsforu.com/resources/differences-between-smd-smt-tht.
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What Are DIP, SMD, QFP And BGA IC Packages?

There are many types of IC packages, each having unique dimensions, mounting types and/or pin counts. Most common IC package types include DIP, surface-mount device (SMD), small-outline package (SOP), quad-flat package (QFP) and ball-grid array (BGA). Dual-in-line package (DIP) It is the most common through-hole IC package used in circuits, especially hobby projects. This IC […]

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View more at https://electronicsforu.com/resources/dip-smd-qfp-bga-ic-packages.
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A Practical Guide Using Multiport S-Parameters to Enhance Signal Integrity

Hyperscale data centers are a critical component of today’s internet infrastructure. This architecture requires extreme bandwidth over everything copper and demands next-level design techniques and analysis tools in the signal integrity lab. This webinar will clarify how to achieve the highest practical signal integrity (SI) of the physical layer by analyzing an example channel with […]

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View more at https://electronicsforu.com/technology-trends/news/practical-guide-multiport-s-parameters-enhance-signal-integrity.
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All New Teensy 4.0 – The Fastest Dev Board powered by ARM Cortex-M7

The latest offering from Teensy, Teensy 4.0 is the fastest microcontroller available today which is powered...

The post All New Teensy 4.0 – The Fastest Dev Board powered by ARM Cortex-M7 appeared first on Electronics-Lab.



View more at https://www.electronics-lab.com/new-teensy-4-0-fastest-dev-board-powered-arm-cortex-m7/.
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Developer kit delivers AI solutions to makers

Adding muscle to its SBC and IoT solutions OKdo, part of Electrocomponents, is now selling the...

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View more at https://www.electronics-lab.com/developer-kit-delivers-ai-solutions-makers/.
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