There are many types of IC packages, each having unique dimensions, mounting types and/or pin counts. Most common IC package types include DIP, surface-mount device (SMD), small-outline package (SOP), quad-flat package (QFP) and ball-grid array (BGA). Dual-in-line package (DIP) It is the most common through-hole IC package used in circuits, especially hobby projects. This IC […]
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