A newly expanded lineup of ultra-compact reed relays adds fresh Form A/B/C and coaxial options, pushing switching density higher for automated test systems struggling with shrinking PCB real estate. In automated test equipment (ATE) and dense switching matrices, board space has become the new bottleneck. Pickering Electronics latest expansion of its ultra-high-density Series 125 aims […]View more at https://www.electronicsforu.com/news/ultra-high-density-reed-relay-platform.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
