The eco-friendly approach could transform the PCB industry by cutting costs, reducing waste, and powering the future of wearable tech. Researchers at Boise State University have developed a method for manufacturing flexible hybrid circuits that promises to slash production costs, minimize waste, and reduce environmental impact. Their breakthrough, which utilizes laser-induced graphene (LIG), was recently […]
View more at https://www.electronicsforu.com/news/flexible-electronics-with-laser-induced-graphene.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
