Stanford University researchers have unveiled a material—niobium phosphide—that could revolutionize chip design by dramatically reducing energy loss in ultra-thin interconnects. The relentless pursuit of smaller, faster electronic devices has driven technological advancements, but with miniaturization comes a challenge: heat. As electronic components shrink, the amount of heat generated increases, particularly in the wiring that connects […]
View more at https://www.electronicsforu.com/news/chip-technology-for-ultra-efficient-interconnects.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
