An electronic stacking method could significantly increase the number of chip transistors, improving AI hardware efficiency. MIT engineers have created a new type of chip that doesn’t need silicon wafers and works at lower temperatures to protect the circuits underneath. This method lets them build chips with materials stacked directly on each other, allowing components […]
View more at https://www.electronicsforu.com/news/chip-design-improves-performance-without-silicon.
Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed
