Researchers at Carnegie Mellon University and Olin College of Engineering have explored using contact microphones to train ML models for robot manipulation with audio data.
Two-stage model training. AVID and R3M pretraining leverages the large scale of internet video data (blue dashed box). We initialize the vision and audio encoders with the resulting pre-trained representations and then train the entire policy end-to-end with behavior cloning from a small number of in-domain demonstrations. The policy takes image and spectrogram inputs (left) and outputs a sequence of actions in delta end effector space (right). Credit: Mejia et al.
Robots designed for real-world tasks in various settings must effectively grasp and manipulate objects. Recent developments in machine learning-based models have aimed to enhance these capabilities. While successful models often rely on extensive pretraining on datasets filled mainly with visual data, some also integrate tactile information to improve performance.
Researchers at Carnegie Mellon University and Olin College of Engineering have investigated contact microphones as an alternative to traditional tactile sensors. This approach allows the training of machine learning models for robot manipulation using audio data.
In contrast to the abundance of visual data, it is still being determined what relevant internet-scale data could be used for pretraining other modalities like tactile sensing, which is increasingly crucial in the low-data regimes typical in robotics applications. This gap is addressed by using contact microphones as an alternative tactile sensor.
In their recent research, the team used a self-supervised machine learning model that was pre-trained on the Audioset dataset, which includes over 2 million 10-second video clips featuring various sounds and music collected from the web. This model employs audio-visual instance discrimination (AVID), a method capable of distinguishing between diverse types of audio-visual content.
The team evaluated their model by conducting tests where a robot had to complete real-world manipulation tasks based on no more than 60 demonstrations per task. The results were very encouraging. The model demonstrated superior performance compared to those relying solely on visual data, especially in scenarios where the objects and settings varied significantly from the training dataset.
The key insight is that contact microphones inherently capture audio-based information. This allows the use of large-scale audiovisual pretraining to obtain representations that enhance the performance of robotic manipulation. This method is the first to leverage large-scale multisensory pre-training for robotic manipulation.
Looking ahead, the team’s research could pave the way for advanced robot manipulation using pre-trained multimodal machine learning models. Their approach has the potential for further enhancement and wider testing across diverse real-world manipulation tasks.
Reference: Jared Mejia et al, Hearing Touch: Audio-Visual Pretraining for Contact-Rich Manipulation, arXiv (2024). DOI: 10.48550/arxiv.2405.08576
The robust design and wide operating temperature range make these resistors ideal for automotive, industrial electronics, and power supply applications.
Vishay Intertechnology, Inc has unveiled that 5 W devices in its AC and AC-AT series of cemented, axial-leaded wirewound resistors now feature a pick-and-place-friendly SMD lead bending option, the WSZ lead form, which transforms these devices into surface-mount components. The Draloric AC05 WSZ and AEC-Q200 qualified AC05-AT WSZ resistors, also available in a non-inductive version (AC05-NI WSZ), are designed for fast-switching circuits and exhibit excellent pulse capability.
The key features include:
Peak power up to 5 kW for a 1 μs pulse load
Broad resistance range from 0.10 Ω to 10 kΩ
Operating temperature range from -55 °C to +250 °C
Wirewound construction for high mechanical resistance
Thermal shock resilience at elevated temperatures
The WSZ lead form enables these resistors to be assembled on PCBs alongside other surface-mount components, enhancing the pick-and-place process, reducing assembly times, and lowering costs. These devices are ideal for use as snubber and inrush current limiting resistors in pre-charge/discharge applications across automotive and industrial electronics, energy meters, and power supplies for white goods.
Engineered for challenging operating conditions, the AC05 WSZ and AC05-AT WSZ feature a robust, non-flammable silicone cement coating that meets UL 94 V-0 standards. These RoHS-compliant, halogen-free devices come with tin-plated terminations, ensuring compatibility with both lead (Pb)-free and lead (Pb)-containing soldering processes. Samples and production quantities of the AC05 WSZ and AC05-AT WSZ are currently available, with lead times set at 12 weeks.
MIT and MITRE researchers have created a “quantum-system-on-chip” (QSoC) that integrates thousands of qubits, enabling scalable and precise quantum computing.
Researchers developed a modular fabrication process to produce a quantum-system-on-chip which integrates an array of artificial atom qubits onto a semiconductor chip.
Credits:Image: Sampson Wilcox and Linsen Li, RLE
Quantum computers could swiftly solve complex problems that take current supercomputers decades, but building a system with millions of interconnected qubits presents a significant global challenge.
Researchers at MIT and MITRE have developed a “quantum-system-on-chip” (QSoC) that integrates thousands of qubits for scalable, precise quantum computing. This system supports “entanglement multiplexing” and links multiple chips via optical networking to form a quantum network. The team has also perfected a method to efficiently transfer two-dimensional qubit arrays onto a CMOS chip in one step.
Diamond microchip lets
The researchers chose diamond colour centres as qubits for their scalability and previous integration with photonic circuitry. These qubits, featuring photonic interfaces, allow remote entanglement with non-adjacent qubits, which is essential for managing inhomogeneity in large systems. They integrated an extensive array of these qubits onto a CMOS chip with digital logic that adjusts voltages automatically, ensuring connectivity across thousands of qubits.
Lock-and-release fabrication
To develop the QSoC, researchers devised a large-scale method to transfer diamond colour centre “microchiplets” onto a CMOS backplane. Starting with an array from a diamond block and designing nanoscale antennas to collect photons, they post-processed a CMOS chip to align with these microchiplets. Using a lock-and-release technique in-house, they secured the microchip, letting in the chip sockets, enabling the transfer of a 500-micron area with the potential for larger-scale applications. Scaling up also reduces the voltage needed for frequency tuning.
Following extensive nanostructure testing for optimal integration, the team devised methods to measure system performance extensively. They used a custom cryo-optical metrology setup to tune over 4,000 qubits to the same frequency while maintaining their properties. Additionally, they developed a digital twin simulation to enhance understanding and implementation of the architecture, connecting experimental results with digital models for better insight into the quantum system’s functionality.
In the future, researchers could enhance their system by improving qubit materials or refining control processes. They might also extend this architecture to other solid-state quantum systems.
The design features compact components suitable for creating efficient heart rate monitors with advanced functionality and performance.
Wearable devices are valued for compactness, often designed to be as small as conventional watches, wristbands, or finger scanners. As technology progresses, the challenge for designers is to integrate an increasing number of functions into these devices, with the size of each component playing a critical role in how many features can be included. Additionally, these devices are optimized for low-power usage, utilizing batteries as their primary power source. Given the limited size and energy capacity of the batteries, this is crucial to extend the device’s operational life. Most wearable devices operate in standby mode over 90% of the time, making low standby power consumption vital. Furthermore, as market demands shift towards higher precision, the accuracy of these devices has become a critical selling point, with only the most precise devices gaining acceptance in the market. The MAXREFDES1207 from Analog Devices (ADI) is a reference design tailored for wearable applications.
It incorporates the MAX32660, MAX30112, MAX77651B, and MAX40005 components. This design facilitates the creation of a compact, cost-effective, low-power, and highly accurate heart rate monitor using two green LEDs.
The MAX30112 is a specialized pulse oximeter and heart rate analog front-end (AFE) designed for wearable health applications. It features a high-resolution optical signal processing channel with ambient light cancellation and high-current LED driver DACs, creating a complete optical signal chain. Using external LEDs and photodiodes, the MAX30112 provides an optimal solution for heart rate detection in wrist-worn devices due to its low power consumption and high performance.
The MAX77651B enhances the design with an integrated battery charging and power management solution, which is crucial for wearable devices where size and efficiency matter. It includes a SIMO buck-boost regulator, which delivers three separate power rails from a single inductor to reduce the overall size. It also features a versatile linear charger supporting various Li+ battery sizes and monitoring battery temperature for added safety (JEITA standards).
The MAX32660 is an ultra-low-power, cost-effective microcontroller (MCU) suitable for battery-operated devices and wireless sensors. It merges a flexible power management unit with a powerful Arm® Cortex®-M4 processor equipped with a floating-point unit (FPU).
The MAX40005, a compact single comparator, is perfect for portable electronics with severe space and power limitations, such as cell phones, media players, and notebooks. Additionally, the design includes an FTDI FT234 USB-to-serial UART interface.
The main features and benefits of the design include an integrated solution that ensures a seamless performance, compact size for convenience and portability, low power consumption for extended use, and high accuracy in its functionality. These attributes make it suitable for users seeking efficiency and reliability in a single package.
ADI has tested this reference design. It comes with a bill of materials (BOM), schematics, a printed circuit board (PCB) layout, etc. You can find additional data about the reference design on the company’s website. To read more about this reference design, click here.
Designed for next-generation network and cloud applications, this powerful SoM is set to revolutionize data centers, 5G networks, and communication test equipment.
iWave announces the launch of the iW-RainboW-G63M, a System on Module (SoM) built on the AMD Versal Premium series. This new SoM is designed for next-generation network and cloud deployments, offering a robust solution for data centers, 5G networks, and communication test equipment. Available for evaluation the kits promise to revolutionize network and cloud technology.
It is compatible with a range of chipsets including VP1552, VP1502, VP1402, VP1202, and VP1102. It features an integrated 4GB LPDDR4 RAM, 256MB QSPI Flash, 16GB eMMC Flash, and 4Kbit EEPROM. The module includes three high-speed expansion connectors that support transceiver channels up to 112Gbps and provide 192 user-configurable IOs, ensuring a versatile and powerful interface for users.
This Versal Premium-based SoM boasts networked, power-optimized cores with numerous high-speed connectivity options. The 112Gbps transceiver blocks, multi-hundred-gigabit Ethernet, and PCIe Gen5 with built-in DMA offer unparalleled flexibility in supporting various data rates and protocols.
Key features of the iW-RainboW-G63M include:
Compatibility : Pin-compatible with VP1552, VP1502, VP1402, VP1202, VP1102
Processing Power : Dual Arm Cortex-A72 @1.7GHz and Dual Arm Cortex-R5F @800MHz
Logic and LUTs : Up to 3837K logic cells and 1754K LUTs
Form Factor : 120mm x 90mm, Industrial grade with a 10-15 year product longevity
“The SoM leverages the adaptive portfolio of Versal Premium, enabling the creation of fast and secure networks and providing adaptable acceleration for data-intensive workloads transforming networks and data centers,” said Abdullah Khan M, Director of Engineering at iWave Systems. “This SoM is ideal for applications such as data center interconnect, digital adaptive radars, network testers, metro/core transport, and security appliances.”
Calculating the area of a Printed Circuit Board (PCB) accurately is essential for optimizing the layout and cost-effectiveness of these crucial components in electronic devices. This guide provides a systematic approach to measuring PCB area for PCB Design, a fundamental step that influences the entire design and manufacturing process.
Understanding how to calculate the PCB area effectively helps design engineers achieve the best cost-to-space ratio, ensuring efficient material usage and cost management.
Whether dealing with individual PCBs or multiple boards in a panel, the following steps will equip you with the necessary knowledge to calculate areas accurately and make informed decisions about PCB design and production.
Design engineers often face the challenge of optimizing the layout and cost-effectiveness of PCBs. Calculating the area of a PCB accurately and understanding how to achieve the best cost-to-space ratio are critical aspects of PCB design.
Here’s a step-by-step guide to help you navigate these calculations and considerations:
Step 1: Calculate the Area of a Single PCB
To find the area of a single PCB:
Measure the dimensions of the PCB in millimeters (length and width).
Calculate the area by multiplying the length by the width, then divide the result by 1,000,000 to convert the area from square millimeters to square meters.
Formula:
Area (sqm) = (Length (mm) * Width (mm)) / 1,000,000
Example:
PCB size is 100mm X 100mm
Area = 100mm X 100mm / 10,00,000 = 0.01 Square meter
Step 2: Calculate the Area for a PCB Panel
If multiple PCBs are arranged in a panel:
Measure the panel dimensions (length and width in millimeters).
Calculate the panel area using the same formula as for a single PCB.
Determine the number of PCBs per panel.
Divide the panel area by the number of PCBs to get the area of one PCB.
Example:
Panel size = 250mm X 300mm
PCBs per Panel = 6
Panel Area = 250mm X 300mm /10,00,000 = 0.075 Square meter
Single PCB Area = 0.075sqm / 6 PCBs per panel = 0.0125 Square meter
Step 3: Evaluate the Total Area for Production Batches
For large-scale production:
Calculate the area of a single PCB as described above.
Multiply this area by the total number of PCBs in the batch to get the total area.
Example:
Single PCB Area = 0.0125 Square meter
Quantity = 10,000
Total Area = 0.0125 X 10,000 = 125 Square meter
Step 4: Optimize Cost-to-Space Ratio
Material and Fabrication Costs: Consider different materials and fabrication methods that might offer better durability or lower costs without compromising quality.
Design Efficiency: Use space efficiently by minimizing unused areas and optimizing trace routing to reduce the size without affecting functionality.
Panelization Efficiency: Maximize the number of PCBs per panel to reduce waste and machining costs.
Scaling Production: Larger production volumes typically reduce the cost per unit due to economies of scale.
Negotiate with Suppliers: Obtain multiple quotes and negotiate with suppliers for better rates on materials and components.
Additional Considerations
Design for Manufacturability (DFM): Check designs against production capabilities to ensure they can be manufactured without costly modifications.
Testing and Prototyping: Include costs for testing and prototyping to avoid expensive errors in full-scale production.
By carefully calculating PCB areas and evaluating cost-to-space ratios, design engineers can effectively manage resources, reduce waste, and control production costs, leading to more efficient and economical PCB designs.
Optimizing Cost-to-Space Ratioin PCBs
Optimizing the cost-to-space ratio in PCB designs is crucial for reducing manufacturing costs while maximizing the functional capacity of the boards. This involves careful planning and design strategies to use the available space efficiently and economically.
Here are some key steps and considerations for optimizing the cost-to-space ratio in PCBs:
Efficient Use of PCB Real Estate
Minimize PCB Size: Design smaller PCBs to reduce material costs. Use space-saving components and minimize the board’s footprint without compromising the functionality.
Component Placement: Arrange components in a way that maximizes space utilization. Place similar components together and use both sides of the PCB if necessary.
Integrated Circuits: Use integrated circuits that combine the functionality of multiple components into a single package, thereby reducing the number of components needed.
Shape and Panelization
PCB Shapes: Selecting non-standard PCB shapes like hexagonal, circular, rectangular, or triangular can impact the cost-to-space ratio. Intelligent design and placement can optimize space utilization and reduce waste.
Intelligent Panelization: Using AI tools for panel design can intelligently place various PCB shapes on a panel to optimize space. AI tools for panelizing PCBs help in saving time in analysis and panelizing, thus optimizing cost and panel size requirements for manufacturing.
AI Tools for PCB Panelization
Several companies offer sophisticated AI tools that enhance panelization and size optimization:
Mentor Graphics Valor NPI: Provides advanced PCB manufacturing and assembly solutions, including panelization optimization. It leverages AI algorithms to intelligently place PCBs on panels for efficient space utilization and cost savings.
Siemens Xcelerator PCB Systems Design: Features a suite of PCB design and analysis tools with capabilities for layout optimization and panelization. Its AI-driven features automate the process of placing PCBs on panels to maximize space utilization and minimize manufacturing costs.
PCB-Investigator: A software tool for PCB design analysis and optimization that offers features for panelization and space-saving techniques. It utilizes AI algorithms to intelligently arrange PCBs on panels for optimal efficiency.
EasyEDA: A web-based PCB design tool that, while may not have as advanced AI capabilities as some other tools, provides functionalities for intelligently placing PCBs on panels to save space and reduce costs.
Layer Optimization
Multi-layer Boards: Use multi-layer configurations to enhance circuit density and save space. However, more layers can increase the cost, so balance the number of layers against the increase in manufacturing complexity and cost.
Layer Utilization: Ensure each layer is optimally utilized to avoid wastage of space and materials.
Design for Manufacturability (DFM)
DFM Guidelines: Follow DFM guidelines to avoid costly redesigns and modifications. Ensure the design is compatible with manufacturing capabilities and limitations.
Standardized Components: Use standard component sizes and footprints to reduce costs associated with specialized manufacturing processes.
Technology and Material Selection
Material Choice: Choose materials that offer a good balance between performance and cost. Consider the dielectric properties, thermal stability, and durability.
Advanced Technologies: Evaluate the cost-benefit of using advanced technologies like HDI (High Density Interconnect) which can significantly increase the space utilization but may also increase the cost.
Simulations and Prototyping
Early Testing: Conduct simulations and create prototypes early in the design process to identify and rectify potential issues that could lead to wastage and additional costs.
Iterative Design: Use the feedback from testing to refine the design, focusing on optimizing the space and reducing unnecessary costs.
Negotiations and Volume Discounts
Supplier Negotiations: Negotiate with suppliers for better prices on components, especially for high-volume orders.
Economies of Scale: Plan for production in larger volumes to benefit from lower per-unit costs.
Accurately calculating PCB areas is vital for optimizing design efficiency and cost-effectiveness in PCB production. By following the detailed steps provided for measuring single PCBs, panels, and production batches, design engineers can effectively manage resources, reduce waste, and control production costs.
This not only leads to more efficient and economical PCB designs but also enhances the functionality and reliability of the final products.
Adhering to these guidelines ensures that PCB designs are optimized for both space and cost, which are crucial for the competitive electronics manufacturing landscape.
We are seeking a skilled Embedded Engineer with expertise in communication, control, and Digital interfaces with 3 -10 years of experience to join our dynamic team. The ideal candidate will have a strong background in embedded systems development, with a focus on Firmware development integrating communication, control, and Diagnostics in diverse applications.
Key Responsibilities and skills
Design, develop, and debug embedded systems that integrate communication interfaces, control algorithms, and power electronics components.
Implement communication protocols such as TCP/IP, MQTT, and Modbus for seamless data exchange between embedded systems and external devices. Knowledge of communication protocols such as TCP/IP, MQTT, Modbus, CAN, and Ethernet.
Collaborate with hardware engineers to integrate embedded systems with electronic hardware components, including power converters, motor drives, and sensors.
Conduct testing and validation of embedded systems in laboratory environments, analyzing results and making necessary adjustments.
Ensure compliance with industry standards and regulations, particularly in the context of communication, control, and power electronics. – Excellent communication and teamwork skills, with the ability to collaborate effectively with colleagues and stakeholders.
Proficiency in programming languages such as C/C++ for embedded systems.
Experience with microcontroller/microprocessor-based systems and real-time operating systems.
Excellent problem-solving skills and attention to detail.
Qualifications
Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related field.
A master’s degree from prestigious institutes in power electronics, Control Engineering, Drives or related field is considered an advantage.
Benefits
Competitive salary and benefits package, including health insurance, retirement plans, and performance bonuses.
Opportunities for professional development and career growth within a global leader in power electronics
A dynamic and collaborative work environment with opportunities to work on cutting-edge projects and technologies.
Delta Electronics India Pvt Ltd. Is an equal opportunity employer and welcomes candidates from all backgrounds to apply.
Design and Develop HW, validates the products according to the specification and Valeo design rules
Applies the standards and the associated technologies linked to this product family
Documentation according to HW development methodology (Design justification file, HSI, HMI, component specifications, …)
Support the customer validation and design review activities
All the documentation required for the product industrialization and support our EMS (Electronic Manufacturing Supplier) during the industrialization phase
Responsibilities
Responsible for the design of the product in accordance with the customer specification and Valeo design rules
Work together with PCB layout engineer and take responsibilities for the quality of PCB layout.
Responsible for the HW product validation and industrialization
Responsible for the HW technical documentation with respect of the HW development methodology and the design review preparation.
Responsible to deliver document in time to PM
Responsible for the integration of the different domains constraints (HW, SW, purchasing, industrialization, mechanic, quality) into the product HW design
To contribute to the definition and the improvement of standard documents linked to supplier selection, electronics components qualification and usage
Applying the Environment Safety and Security procedures and good practices; know for their activities and the activities of subcontractors the potential risks and their consequences. Be attentive and responsive to them and manage the associated action plans.
Education/Training
Bachelor/Masters of Electronics Engineering
Professional Experience
Hardware Engineer: 2-5 years in embedded electronic design (component technology, ECU, digital & analog electronics, Digital electronics)
Sr. Hardware Engineer: Atleast 6+ years in embedded electronic design (component technology, ECU, digital & analog electronics, Digital electronics, DC/DC converters)
Electronics contract manufacturer TESCOM aims to be “the drone manufacturer of India.” In a candid conversation with EFY, TESCOM’s V. Balasubramani (Founder and MD) and B. Nandini (Director) and Flying Wedge’s Founder Suhas Tejaskanda revealed the company’s aspirational plans and investments to surpass Chinese prices and lead a drone manufacturing ecosystem in India.
Q. What types of electronic products does TESCOM manufacture, and who are your primary customer segments?
A. TESCOM has been in the electronics manufacturing service business for over 35 years. We’ve served as a contract manufacturer for diverse OEMs in automotive, IoT, medical electronics, industrial automation, defence, aerospace, and consumer electronics. Operating from three units in Bangalore and equipped with high-speed SMT lines in Coimbatore and Hosur, TESCOM stands out as the first Indian company for large-scale IoT module production. Renowned for our capabilities in handling 03015 package components, our equipment ensures optimal yields, which is our USP.
Q. What are your thoughts about the potential for growth for Drones in India?
A. The Indian Government views the drone sector as a major growth area, projecting a value of 295,000 crores by 2030, as per the EY FICCI report. Even with 50% indigenisation, this translates to a substantial 1,47,500 crores in Indian manufacturing. The rise of the drone industry will trigger manufacturing benefits across subcomponents such as motors, payloads, communication modules, batteries, propellers, assembly, navigation systems, and airframes. This, according to the report, will foster indigenisation in allied industries, aligning with the “Make in India” initiative and contributing significantly to India’s economy.
Q. What key capabilities are you building to cater to the unique requirements of the drone market?
A. TESCOM has proposed a 15-acre drone park that will house the entire drone ecosystem. We will follow the model where this ecosystem will supply to all in the drone market. We plan to have machining players, motor manufacturers, carbon fibre sheet processing, flight controller manufacturing, battery packs, and the other necessary sub-assemblies to meet the end-to-end needs of the drone industry. TESCOM’s pricing will beat international competition with the expected volume and growth.
Drone testing needs a minimum of 5 acres of open land, a lab setup, and a classroom to train pilots, as per the DGCA guidelines, and we already possess this. We also plan to develop a Remote Pilot Training Organization to train drone pilots. This will complete the ecosystem and generate employment in rural areas. Customisation of drone manufacturing for different customers will be the highlight of this ecosystem.
Q. How do you manage the drone supply chain, including sourcing components and dealing with potential shortages?
A. Initially reliant on Chinese suppliers, we faced concerns with motor shortages. We’ve shifted to indigenous suppliers, validated their strengths, and aimed to expand this network. Collaborating with startups, we focus on R&D in battery manufacturing. The Electronics City Industries Cluster provides mechanical parts and we are working to increase their output. TESCOM and Flying Wedge aim for over 90% indigenisation of drone derivatives, with plans to manufacture all components except lithium core sourcing and ICs. Government schemes for MSMEs and large companies in the drone segment align with our goals. Initiatives to make parts in-house are underway, with a strategy to scale up current efforts.
Q. Are there any challenges you’ve encountered in this process? How did you overcome them?
A. We currently face challenges in sourcing lithium core and semiconductors, which are still being imported. We are sure that with India’s semiconductor policy, we will soon become self-sufficient with ICs. Since we depend on a few other countries for lithium core availability, we are working with our partners to identify other solutions apart from lithium. Though this is in a very nascent stage, we are sure of achieving this as well.
Q. What motivated you to partner with Flying Wedge?
A. The product quality, aligned and shared vision of both the companies, values between both the companies, knowledge, skill, and expertise of the Flying Wedge team are very refreshing and worthy to emulate. The cultural fit between our companies has been good, and we value each other and the strategic partnership. TESCOM and Flying Wedge are always ready for continuous improvement, which has been our driving force. We were quick to understand and concrete our partnership to be prepared to meet the global boom.
Q. What is the USP of Flying Wedge’s drones as compared to its competitors?
A. Flying Wedge is India’s first DGCA type-certified drone technology for agriculture. Its pesticide-carrying drones feature lightweight, easily interchangeable tanks designed for quick handling without external tools. Flying Wedge drones boast of a sturdy design, utilising aluminium and carbon fibre instead of plastic, enhancing airframe lifespan and crash durability. They are modular, portable, and easily reconfigurable for various use cases. A two-wheeler with a box case replaces the need for multiple people, large vehicles, and diesel, reducing operational costs. Equipped with auto-flight safety checks and mandatory health monitoring, these drones offer autonomous flights with built-in workflows and user-friendly interfaces.
Q. What are the types of drones Flying Wedge produces?
A. Flying Wedge was launched in February 2022, beginning with catcher drones which were supplied to L&T. We view this as a breakthrough and a milestone in our journey. From there, we developed the best-in-class agricultural and defence drones. We proudly hold a monopoly in the unique catcher and killer drone market. Our surveillance drones are actively guarding India’s borders and critical personnel.
Q. How will this USP affect Flying Wedge’s customers, and why should it matter to them?
A. Our cost reduction and innovative techniques will undoubtedly impact the drone industry. The modular nature will increase our drones’ popularity and ease of management. This will give us an edge over competitors who import drones as CKD and assemble them in India. Farmers will find our drones more comfortable to use with swappable tanks. Customers prioritise cost, comfort, and service, so they highly value our unique selling proposition (USP).
Q. What were the challenges Flying Wedge faced in developing this USP?
A. The first challenge was understanding what our competitors offered and making our strength and business model as our USP. Our target customers needed a cost-effective, easy-to-handle solution, and we had to work towards that. Initially, we used plastic for internal parts and components like the folding mechanism which holds the motor and the arm. This mechanism undergoes maximum stress, and redesigning it to aluminium while maintaining precision was challenging. Similarly, we worked towards a swappable pesticide tank and successfully achieved it. Our software was initially open-source, but later, we developed our customised software and firmware that is simple and stable. It is indeed a bold attempt to invest a huge amount of money in developing technology as a startup. We had no flying object type certified in India to look for a reference when we started, and we had to completely depend on foreign technologies, be it manned airplanes or unmanned aircraft. We wanted to change this and have a technology of our own to make India proud. The initial days of R&D were quite disappointing. The entire team struggled for about a year and finally achieved it. We are now India’s first and only type-certified indigenous unmanned aircraft technology company for the agriculture sector. Raising funds for R&D was the biggest challenge that we faced. Nobody was willing to believe in a group of youngsters trying out a new technology and a new product. At every stage, we had to prove ourselves and establish our competence.
Q. For which categories of drones have you partnered with TESCOM?
A. Currently, we have partnered with TESCOM for agricultural drones. We are sure of a long-term relationship where we also intend to extend the collaboration for defence drones. We have also partnered with TESCOM in the agricultural sector, showcasing drones as a service to the farmers.
Q. What key reasons prompted Flying Wedge to partner with TESCOM?
A. Flying Wedge is phenomenally good at research and technology. We were looking for an exceptionally good partner with expertise in electronics manufacturing and assembly. TESCOM’s managing director, V. Balasubramani, and director, Nandini, come with a combined experience of more than 50 years in the industry. They have been instrumental in building the Electronic City ecosystem. Balasubramani’s entrepreneurial capacity and risk-taking ability is very high, and they greatly aid in developing new ideas and projects.
We believe the relationship between an organisation and its supplier should go beyond simple buying and selling. It should have synergy in trust-building and alignment of goals. With TESCOM, we have found the comfort of managing the business and planning for risk management activities together. This has resulted in improvement in all sectors and helps Flying Wedge stay ahead of the curve. The strategic partnership is also helping in significant cost reduction. Also, TESCOM has served as a crucial lifeline during supply chain disruptions, offering alternate sources of supply or stepping in as contingency partners. This partnership ensures business continuity and fortifies the organisation’s resilience in the face of unforeseen challenges.
Q. Do you have similar partnerships with other manufacturers for other categories of drones?
A. We’ve partnered with the Electronic City Industries Association (ELCIA) Cluster. We manufacture the mechanical components at the ELCIA Cluster, which is also under the supervision of TESCOM. This unique consortium is India’s first and only unmanned aircraft manufacturing hub. Since TESCOM manages our supply chain and has demonstrated specialised knowledge for innovation in every aspect of manufacturing and they have been a part of our journey, we have never felt the need to partner with other manufacturers.
Q. What unique advantage can TESCOM offer its customers through partnership?
Prajwal Bhat, Co founder, Flying Wedge
A. Our integrated manufacturing facility ensures the lowest cost, matching or surpassing Chinese prices. Swift delivery is a priority, and transparency in operations fosters customer loyalty. We prioritise partnerships aligned with shared goals, offering cost, quality, and innovation advantages through controlled supply chains.
In the dynamic landscape of rapid innovation, our intent is to create a competitive advantage for customers. Collaborative partnerships enable us to understand market requirements, ensuring a continuous supply chain while fostering innovation. Through strategic alliances, we transform into valued business partners, translating benefits for customers. Our centralised manufacturing, coupled with planned automation, guarantees the highest quality and efficiency.
Q. Will such a partnership enable TESCOM to attract more drone customers, or will it act as a deterrent?
A. Partnering with customers will allow us to anticipate what our customers need and, in turn, understand what the market needs. We can be more engaged with the customer and build loyalty and trust as we will take ownership of the business by understanding end customer and market needs. With the current plan and strategy, since we will always be market-ready, we may attract more customers. As contract manufacturers, we always maintain the confidentiality of our customers, so handling multiple customers from the same vertical will not be a challenge. We plan to have separate manufacturing blocks in our drone park where each customer’s design will be taken for manufacturing. This will ensure total confidentiality.
Q. Why should drone OEMs look at outsourcing their manufacturing to TESCOM and not setting up their plant?
A. TESCOM offers drone OEMs valuable partnerships, ensuring agility, responsiveness, and economies of scale to meet sudden demand surges. Outsourcing to TESCOM alleviates concerns about the fragile global supply chain affected by geopolitical changes. Plans for a 15-acre drone park, with strategic partners for key components, ensure a hurdle-free supply chain. TESCOM’s horizontal integration aims to address challenges, positioning it as a leading player in drone manufacturing. Though not fully mature, drone technology and demand benefit from TESCOM’s large-scale horizontal integration, providing early access to solutions. The seamless ecosystem created by TESCOM will make its offerings attractive for the OEMs.
Q. Is TESCOM ready to work with startups that initially deal in very low quantities of drones, or are you aiming for the major players?
A. TESCOM will support startups by offering alignment, assistance, and long-term guidance. Our objective is to become the preferred white-label manufacturer for major OEMs, ensuring controlled processes and quality systems. We aim to surpass Chinese prices and supply chain efficiency by catering to small and large companies. Our ultimate goal is customisation and white labelling, with a commitment to confidentiality through unique designs for each customer.
Q. How does TESCOM view various initiatives and policies by the government of India (and some state governments) to drive demand for drones in India?
A. India has implemented leading regulations and policies addressing drone industry demand and supply through PLI and import bans. The global market is expected to follow suit, fostering rapid growth. The Drone Rules 2021 is a pivotal change for India’s drone industry. Central government subsidies include the NAMO Drone Didi Scheme (80% subsidy up to 8 lakhs), FPO Kisan Drone Subsidy (75% subsidy), and Individual Kisan Drone (50% subsidy up to 5 lakhs). Government initiatives like Vikasit Bharat Sankalp Yatra raise awareness. IFFCO procured 2500 drones this year, planning to support agriculturists more. Collaboration among ministries and departments addresses industry challenges, supporting startups and large companies for ecosystem development. Schemes for women and self-help groups highlight the inclusion of women pilots in India’s growing drone sector.
Q. What is your vision for TESCOM regarding drone manufacturing in India?
A. TESCOM aims to be India’s drone manufacturer, and our vision is aligned with the Indian government’s vision to turn India into a global drone hub. We intend to lead India’s drone manufacturing aspirations by becoming India’s premier drone destination. We want to lead the manufacturing of a seamless supply of all types of drones from all sectors and all categories. Our team headed by our Director Nandini is working on this at various levels and consolidating all the available resources in India.
Q. What challenges does TESCOM see in achieving this vision, and how do you plan to overcome them?
A. The communication gap between lawmakers and drone makers will be a challenge. Also, slow technology adoption due to a lack of awareness will delay the industry’s growth. The fear of losing jobs in the ground-level workforce in the agricultural sector will also be challenging. Issues may arise in getting permission for drone flights, and overseas demonstration of drone technology will be challenging. Without export, we cannot lead in the sector, so regulatory bodies need to help us in easing out export norms for drones.
Discussions with central and state government departments are underway, and we are collectively expressing our concerns. We see that the support we are getting from the government machinery is phenomenal, and all these concerns and challenges will be addressed as the goal and vision of India is to become the “drone capital of the world.”
The design is equipped with a simple serial user interface, facilitating easy interaction and control.
The Reference Design TIDEP0069 by Texas Instruments is an advanced audio solution platform, leveraging the 66AK2Gx DSP + Arm processor and the TLC320AIC3106 audio codec. This design encompasses real-time application software, using TI RTOS, to showcase audio processing capabilities on the DSP, enabling the addition of audio effects. The reference design has been thoroughly tested and includes the K2G General Purpose Evaluation Module (GP EVM) hardware reference along with the Processor SDK software.
It has several key features, including programmable 3-band equalization, which allows for precise adjustments of audio frequencies. It also includes bass, mid, and treble gain controls, providing fine-tuning options for different sound preferences. Additionally, it supports out-of-the-box testing with the K2G General Purpose Evaluation Module (GP EVM), ensuring a streamlined setup and evaluation process. Moreover, this design accommodates sample rates ranging from 8 kHz to 96 kHz, catering to a wide range of audio quality requirements.
The design package includes necessary design files, software, a comprehensive getting started guide, and a user guide for software modification and rebuilding. This audio equalizer is suitable for various applications including home audio systems, automotive amplifier systems, soundbars, professional audio equipment, and automated speech recognition (ASR) preprocessing.
It is versatile and can be applied to various domains. It is well-suited for home audio systems, enhancing the listening experience in domestic settings. In automotive amplifier systems, it provides robust audio solutions for in-car entertainment. Soundbars benefit from its capabilities, offering improved sound quality for home theater setups. Professional audio applications also leverage its advanced features for high-fidelity sound production. Additionally, the design is ideal for automated speech recognition (ASR) preprocessing, ensuring accurate and efficient voice command recognition.
The audio equalizer is engineered for diverse audio applications, such as soundbars and automotive audio amplifiers. The typical setup comprises speakers, headphones, and an audio input source connected to a TI Analog Interface Chip (TLV320AIC3106). The design includes the K2G SoC, which integrates an audio source, speakers, headphones, and a terminal. In the demonstration based on the K2G GP EVM, a PC serves as the terminal and audio source, connected to the SoC through a USB-Serial interface on the K2G GP EVM. This setup features 2GB of DDR3 connected to the K2G SoC DDR interface, providing external RAM for the application.
The audio equalizer application can boot on the SoC using either the S25FL512 flash device connected to the Quad SPI or the SD/MMC card via the SDIO interface on the chip. Additionally, the Cortex-A15 on the K2G SoC can function as the user control interface, allowing designers to use inter-processor communication (IPC) to transmit control messages to the equalizer. This integration offered by the K2G SoC not only reduces cost and saves board space but also facilitates the sharing of external memory and MSMC between the C66x and A15 cores.
The TI Audio Equalizer design capitalizes on the TI 66AK2Gx DSP+Arm System on Chip (SoC) and its peripherals. The 66AK2Gx SoC is a high-performance, highly integrated device, rooted in the TI KeyStone II Multicore SoC architecture. This SoC features the performance-optimized Arm Cortex®-A15 and a C66x DSP core, tailored to address the processing and system-level integration needs of automotive audio, high-performance audio applications, and industrial communications and control.
TI has tested this reference design. It comes with a bill of materials (BOM), schematics, etc. The additional data about the reference design on the company’s website. To read more about this reference design, click here.
This article aims to inform the reader about the applications, procurement, selection & design, and integration of BESS (battery energy storage systems) into LV and MV power networks. The intended... Read more
This article aims to inform the reader about the applications, procurement, selection & design, and integration of BESS (battery energy storage systems) into LV and MV power networks. The intended... Read more
The post BESS (Battery Energy Storage Systems) in LV and MV Power Networks: Practical Guide (Part-1) appeared first on EEP - Electrical Engineering Portal. Credit: EEP- Electrical Engineering Portal. Visit:
Work in coordination with Technical Leads on R&D projects assignments or Hardware Design and Development, Functional Testing, with Focus on Embedded, Power Supply and BLDC Motor controller Hardware Design.
In This Role, Your Responsibilities Will Be:
Preparation of detail design document based on inputs from Leads.
Preparation of schematic
functional testing and validation of Hardware
Writing Test Report
Who You Are:
You readily act on challenges without unnecessary planning. Work Cooperatively with others in the organization. You look for new challenges and willing to go extra mile to solve them. You are willing to work on different Fields of Electronics.
For This Role, You Will Need:
Master’s degree in Electronics with Specialization in Power Electronics or Embedded Electronics
Basic knowledge of test equipment and Procedures
Preferred Qualifications
Master’s Degree
Specialization in Power Electronics
Knowledge of Micro-controllers, Analog, and Digital Circuits
This design is ideal for applications that require accurate temperature monitoring, particularly for human skin, and allows the transfer of temperature data to an NFC receiver, such as an NFC-enabled smartphone.
The Passive NFC Temperature Patch represents a significant advancement in wearable health technology, offering a seamless and efficient way to monitor body temperature continuously. Unlike traditional thermometers, this innovative patch utilizes Near Field Communication (NFC) technology to transmit temperature data to compatible devices without the need for batteries. Its lightweight, flexible design ensures comfort and ease of use, making it ideal for both clinical settings and everyday personal health monitoring. With its ability to provide real-time temperature tracking and its integration with smart health applications, the Passive NFC Temperature Patch is set to revolutionize how we manage and understand our health.
The TIDA-00721 by Texas Instruments is Passive NFC Temperature Patch Reference Design provides an advanced solution for precise temperature measurement using a passive NFC tag in a flexible patch form factor. This system is constructed with several key components to ensure high accuracy and reliable performance. Central to the system is the LMT70, a high-accuracy analog temperature sensor renowned for its precise temperature readings. This sensor effectively captures the local temperature, providing the necessary data for accurate monitoring.
The temperature data collected by the LMT70 is then converted from analog to digital using the ADS1113, a 16-bit Sigma-Delta analog-to-digital converter (ADC). This ADC ensures that the temperature signals are digitized with high resolution and accuracy, maintaining the integrity of the data. Once digitized, the temperature data is managed by the MSP430G2403 microcontroller. This low-power mixed-signal microcontroller is responsible for storing the digitized data and preparing it for transmission. The microcontroller plays a crucial role in ensuring that the data is handled efficiently and accurately.
The stored temperature data is then transmitted via the RF430CL330H, a dynamic NFC interface transponder. This component packages the data into the NFC protocol, ensuring seamless data transfer to an NFC-enabled reader, such as a smartphone. This step is critical for the reliable communication of temperature data between the patch and the receiver. An integrated PCB antenna is included in the design to facilitate NFC communication, making the patch easy to use and implement. Additionally, probe contacts are incorporated for programming or troubleshooting purposes, adding to the design’s flexibility and utility in various applications.
This design is highly versatile and finds applications across a wide range of industries. In the industrial sector, it is well-suited for devices such as blood glucose monitors, CPAP machines, CT detector modules, continuous glucose monitor aggregators, ECG patches, and more. These applications benefit from the design’s ability to ensure accurate temperature readings for calibration, functionality, and patient monitoring. In personal electronics, the design is particularly useful for smart trackers, enhancing the accuracy of activity and fitness monitoring by incorporating precise temperature measurements. This makes it a valuable tool for consumers looking to monitor their health and fitness more accurately.
The Reference Design stands out for its accuracy, integration, and ease of use. By leveraging the capabilities of the LMT70 temperature sensor, ADS1113 ADC, MSP430G2403 microcontroller, and RF430CL330H NFC transponder, this reference design ensures reliable and accurate temperature data transmission through a simple yet effective NFC interface. This makes it an invaluable tool in both industrial and personal electronics applications, providing a sophisticated solution for precise temperature monitoring.
TI has tested this reference design. It comes with a bill of materials (BOM), schematics, etc. You can find additional data about the reference design on the company’s website. To read more about this reference design, click here.
Project scoping, planning and execution of projects in multiple product categories like Low Voltage Switchgear, Breakers, Switches, Fuses, Capacitors, Terminal Blocks etc.
Developing of test methods and test equipment requirements for complex, new or unusual products.
Communicating with clients to discuss technical issues, explain UL procedures and requirements. Convey project cost estimate completion date and sample requirements.
Coordinating complex in-house or external laboratory activities by preparing data sheets and instructions to technicians.
Provide technical assistance in several product categories, operations or systems to laboratory and/or field staff.
Required Education and Qualifications
BE / BTech in Electrical / Electronic Engineering or equivalent education from an accredited University / College.
6-10 years of experience in engineering/design validation/testing and certification/manufacturing etc.
Required Skills & Abilities
Proficient in various safety standards, with an emphasis on IEC, EN, UL, CSA and NEMA. Exposure to ISO/IEC 17025 are highly an added advantage.
Knowledge on UL, CSA, IEC CB Scheme certification and standards like, IEC/EN 60898-1, IEC/EN 61008-1, IEC/EN 61009-1, UL/IEC 60947 Series, UL 810 & UL 1059 standards
Knowledge of IEC CB schemes and global certification would be an added advantage.
Independent decision-making skills and strong structured problem-solving skills.
Ability to work in a fast paced, self-directed environment, document detailed results, And Communicate test results to reviewer and customer.
Required Skills & Abilities
Strong written and verbal communication skills as well as interpersonal skills necessary to work across multiple engineering disciplines, project management, and external customers.
Electronics/Mechanical testing experience.
Proficient with Microsoft Office applications (Excel, Word, PowerPoint).
Must be able to work on multiple projects simultaneously.
Digital Photonics Center of Excellence R & D, Keysight Technologies at Gurugram R & D centre seeks to hire only experienced (10 years +) FPGA Hardware Design Engineers…with familiarity in Xilinx, VHDL, Verilog, PCIe & CXL.
Please reach out with your resume at soumya_dey@keysight.com immediately. Include in the subject line: FPGA Hardware Design Engineer
Job Description
As FPGA Designer, you will be responsible for the definition & development of complex FPGA designs for protocol test (for ex PCIe, CXL, etc) & work in a highly collaborative, fast-paced environment. You will work closely with R&D Project Manager, Product Architects, Solution Teams, Software Qualification and Software Engineers to develop new product offerings & improve existing ones. The candidate should be a strong team worker and should be able and willing to collaborate with other design teams located in US & Europe. If you are passionate about pushing the boundaries of technology and thrive in a collaborative & fast-paced environment, we invite you to join our team and contribute to the advancement of PCIe solutions. The candidate will work closely with teams in Germany and US & coordinate with partners who provide R&D resources necessary for executing the project.
Job Qualifications
Bachelor’s degree or Master’s degree in Electronics / Electrical Engineering.
Essential:
Develop and maintain FPGA designs using hardware description languages (HDLs) such as VHDL or Verilog, ensuring they meet the functional and performance requirements.
We seek candidates who have experience working on large, complex designs within multiple developer environments. This includes collaborating with cross-functional teams, managing dependencies, and ensuring seamless integration across different work streams.
Collaborate with system architects to define the system architecture and determine how the FPGA will interface with other components on the PCA board and choose an appropriate FPGA based on the project’s requirements.
Use FPGA development tools to synthesize and implement the design onto the FPGA, considering resource utilization and timing constraints.
Design & implement the best engineered technical solutions using latest technologies and tools.
Who You Are
Looking for 3 – 12 Months of experience with E&TC background.
An Engineering enthusiast (preferably Electronics and Communication) passed out in the year 2023 with passion in coding & leaning new technology & basic programming skills with general Technology exposure & interest.
Have good communication skill written and spoken
Have good knowledge of Linux commands
Must have Knowledge of Linux/ Unix OS /, and/or shell scripts
Knowledge of basic electronics would be good
Project or internship experience in IoT will be added advantage
Knowledge of atleast one programming language (C/C++/Java/Node)
Knowledge of Scripting like JS/Python
Understanding of cloud based software deployment and support
Have knowledge of IOT
What will excite us
Good Projects during engineering.
Good communication & Aptitude.
Open to learn new technologies & technical languages.
What will excite you
Opportunity to work on large scale enterprise solution building.
Opportunity to explore new technologies & frameworks with accomplished solution architects & industry leaders.
Will get exposure to latest aspects of security, AI/ML, IOT and data analytics.
