New Adhesive Solution For Placement Of Parts And Reflow

It has tack strength to hold materials in place and is near-zero residue adhesive solution, allowing complete evaporation during reflow Designed for holding parts in place during placement and use in formic acid reflow environment is the NC-202, a no-clean, near-zero residue, adhesive solution from Indium Corporation. It is specially formulated with high tack to […]

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