The company’s high-density packaging technology enables creation of a surface mount chip for both high-density packaging and high-efficiency applications Delivers thermal stability and mechanical robustness with low-loss KEMET has further strengthened its power conversion solutions by extending its KC-LINK range using KONNEKT high-density packaging technology for meeting the growing demands of fast-switching wide bandgap (WBG) […]
The post Surface Mount Capacitors For High-Density Power Applications By KEMET appeared first on Electronics For You.
View more at https://www.electronicsforu.com/new-products/surface-mount-capacitor-range-with-high-density-packaging-technology.
Credit- EFY. Published by Department of EEE, ADBU: tinyurl.com/eee-adbu
