“Many Companies Underestimate The Learning Curve And Invest In Partial Setups Without Fully Understanding Test Requirements” – Rahul Gautam, Exeliq

Rahul Gautam, Co-Founder of Exeliq Tech SolutionsWhat does it take to build a reliable EV test lab in an industry where technology changes every few months? Delving into answers, challenges, and solutions, Rahul Gautam of Exeliq speaks with EFY’s Vidushi Saxena about helping OEMs build smart, scalable labs. Q. Can you tell me about the company Exeliq? A. Exeliq is a test and measurement automation company […]

View more at https://www.electronicsforu.com/technology-trends/many-companies-underestimate-the-learning-curve-and-invest-in-partial-setups-without-fully-understanding-test-requirements-rahul-gautam-exeliq.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Field Application Engineer II At TE Connectivity In Delhi And Pune

APPLY HERE Locations: Delhi and Pune Company: TE Connectivity In this role, you will partner with focused TE Connectivity Customers within, High performance Communication and Wireless, Networking, Compute and the IoT markets. It is an exciting opportunity to work at the forefront of next-generation communication technology. The FAE will serve as a technical resource for our […]

View more at https://www.electronicsforu.com/career/field-application-engineer-ii-te-connectivity-delhi-pune.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Jetson Powered Edge AI Vision Box 

A rugged edge AI vision box built on NVIDIA Jetson technology targets autonomous systems with high AI throughput, multi-camera support, and cloud-based device management. A new edge AI vision box by e-con systems aimed at production-grade autonomous and vision-driven systems has been unveiled, combining high-performance AI compute with deep camera and sensor integration in a […]

View more at https://www.electronicsforu.com/news/jetson-powered-edge-ai-vision-box.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Sensing The Flow Right

Sensors for medical and lab designers for fast, stable, easy to integrate and control tiny liquid flows where accuracy directly shapes results. In medical, life science, and microfluidic systems, liquid flow accuracy plays a critical role in determining performance and outcomes. A slight variation in flow can lead to dosing errors and wasted reagents.. As […]

View more at https://www.electronicsforu.com/news/sensing-the-flow-right.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Indoor Positioning Using BLE and Wi‑Fi Triangulation: Real‑Time Indoor Tracking

Fig 2. Trilateration method for positioning and calculationStruggling with GPS indoors? Learn how to build a DIY real-time indoor tracking system using BLE and Wi‑Fi triangulation. Track people, pets, or robots with accuracy and see positions live on your device. Indoor navigation is becoming increasingly important across many applications—from wearables and indoor tracking systems to monitoring pet movement. It also plays a […]

View more at https://www.electronicsforu.com/electronics-projects/indoor-tracking-ble-wifi-triangulation.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

The Rise of Harmonic Distortion in Modern Power Systems

Modern power systems are undergoing a profound transformation. The rise of harmonic distortion is becoming a huge problem. The traditional grid once dominated by large synchronous generators and linear loads—has evolved into a complex, inverter-rich network driven by renewable generation,... Read more

The post The Rise of Harmonic Distortion in Modern Power Systems appeared first on EEP - Electrical Engineering Portal.




View more at: https://electrical-engineering-portal.com/rise-of-harmonic-distortion-in-modern-power-systems Credit- EEE - Electrical Engineering Portal. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed.

Ultra-Thin Materials Bring 3D Chips Closer

A new material, a cooler process, and a stacked design: MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy. In a development that could reshape how future chips are built, MIT researchers have demonstrated a fabrication technique that stacks logic and memory directly on top […]

View more at https://www.electronicsforu.com/news/ultra-thin-materials-bring-3d-chips-closer.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

JOB: Engineer II, Process At CommScope In Goa

APPLY HERE Location: Goa Company: CommScope General Summary: responsible for optimizing manufacturing processes to improve efficiency, quality, and cost-effectiveness by developing new processes, analyzing data, and solving production problems. Key duties include creating and updating work instructions and process documentation, collaborating with cross-functional teams, managing process improvement projects, ensuring safety and environmental compliance, and supporting the […]

View more at https://www.electronicsforu.com/career/engineer-ii-process-commscope-goa.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Why Traditional SBCs Fail And What The Next Generation Fixes

Unlike traditional SBCs, the new edge boards blend CPU, GPU, and NPU in one hybrid system. From robotics to outdoor IoT, a fresh architecture is promising speed and rugged reliability. But what makes it possible? Edge computing is changing fast, much faster than most engineers ever imagined. And as industries rush to push AI closer […]

View more at https://www.electronicsforu.com/special/why-traditional-sbcs-fail-and-what-the-next-generation-fixes.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed

Ultrafast Full Wafer Thickness Mapping

A new film-thickness measurement system promises to collapse wafer inspection times  delivering full 300 mm-wafer thickness maps in under a heartbeat and boosting throughput for semiconductor fabs. The latest entrant to wafer metrology is a thickness measurement device from Hamamatsu Photonics that promises to transform semiconductor process control. The new system delivers full-surface thickness distribution […]

View more at https://www.electronicsforu.com/news/ultrafast-full-wafer-thickness-mapping.

Credit- EFY. Distributed by Department of EEE, ADBU: https://tinyurl.com/eee-adbu
Curated by Jesif Ahmed